林士剛
林士剛
職稱 副教授
電話 62970
電子郵件 linsk@mail.ncku.edu.tw
實驗室

次世代材料設計研究群

 
研究專長 專長:材料熱力學(相平衡與相變化)、計算材料科學(第一原理計算與CALPHAD熱力學計算)
研究領域:電子構裝技術、電遷移效應、鋰離子電池陶瓷電極材料、鋼鐵冶金、超合金與高熵合金設計  
個人網站 http://next-gmaterialdesign.wix.com/aslmtg 
學歷
  • 國立清華大學 化學工程系 博士(中華民國 )
  • 國立清華大學 化學工程系 學士(中華民國 )
經歷
  • 國立成功大學 副教授 (1040801 - 0)
  • 國立成功大學 助理教授 (1000801 - 1040801)
  • Chieh-Szu Huang;Min-Chuan Chang;Cheng-Liang Huang;Shih-kang Lin*,"Thin-film photoluminescent properties and the atomistic model of Mg2TiO4 as a non-rare earth matrix material for red-emitting phosphor",Journal of Electronic Materials;(SCI & EI 08 2016)[link]
  • 吳舒昌;林士桂;蘇彥豪;林士剛*;陸木榮,"高錳鋼連續鑄造之高溫熱機械性質量測與 CALPHAD熱力學解析",; 礦冶季刊vol : 59, no : 3, pp : 1- 13(中華民國期刊論文 07 2015)[link]
  • Amir Reza Ansari Dezfoli;Shih-kang Lin;Wen-Dung Hsu*,"Simulations of domain pattern in lead–titanate by molecular dynamics simulations aided q-state Potts model",Computational Materials Science;vol : 110, no : , pp : 221- 226(SCI & EI 09 2015)[link]
  • Ping-chun Tsai;Sai-Cheong Chung;Shih-kang Lin;Atsuo Yamada*,"Ab initio study of sodium intercalation into disordered carbon",Journal of Materials Chemistry A;(SCI & EI 03 2015)[link]
  • Shih-kang Lin*;Yu-hsiang Wang;Hui-chin Kuo,"Strong coupling effects during Cu/In/Ni interfacial reactions at 280 °C",Intermetallics;(SCI & EI 03 2015)[link]
  • Shih-kang Lin*;Hao-miao Chang;Cheng-liang Cho;Yu-chen Liu;Yi-kai Kuo,"Formation of solid-solution Cu-to-Cu joints using Ga solder and Pt under bump metallurgy for three-dimensional integrated circuits",Electronic Materials Letters;vol : 11, no : 3(SCI & EI 05 2015)[link]
  • Shih-kang Lin;Ru-Bo Chang;Sinn-wen Chen*;Ming-yueh Tsai;Chia-ming Hsu,"Solid-state reactions between Sn-20.0 wt.%In-x wt.%Zn solders and Ag and Ni",Materials Chemistry and Physics;(SCI & EI 01 2015)[link]
  • Shen-Lin Chang;Shih-Yang Lin;Shih-kang Lin;Chi-Hsuan Lee;Ming-Fa Lin*,"Geometric and Electronic Properties of Edge-decorated Graphene Nanoribbons",Scientific Reports;vol : 4, no : , pp : 6038- (SCI & EI 08 2014)[link]
  • Shih-kang Lin*;Ming-yueh Tsai;Ping-chun Tsai;Bo-hsun Hsu,"Formation of alternating interfacial layers in the Au-12Ge/Ni joints",Scientific Reports;vol : 4, no : , pp : 4557- (SCI & EI 04 2014)[link]
  • Shih-kang Lin*;Cheng-liang Cho;Hao-miao Chang,"Interfacial reactions in the Cu/Ga and Cu/Ga/Cu couples",Journal of Electronic Materials;vol : 43, no : 1, pp : 204- 211(SCI & EI 01 2014)[link]
  • Shih-kang Lin;Ru-Bo Chang;Sinn-wen Chen*;Ming-yueh Tsai;Chia-ming Hsu,"Effects of zinc on the interfacial reactions of tin-indium solder joints with copper",Journal of Materials Science;vol : 49, no : 10, pp : 3805- 3815(SCI & EI 10 2014)[link]
  • Ping-chun Tsai;Wen-Dung Hsu;Shih-kang Lin*,"Atomistic structure and ab initio electrochemical properties of the Li4Ti5O12 defect spinel for Li ion batteries",Journal of the Electrochemical Society;vol : 161, no : 3, pp : A439- A444(SCI & EI 03 2014)[link]
  • Shih-kang Lin*;Trong Lan Nguyen;Shu-chang Wu;Yu-hsiang Wang,"Effective suppression of interfacial intermetallic compound growth between Sn-58 wt. % Bi solders and Cu substrates by minor Ga addition",Journal of Alloys and Compounds;vol : 586, no : , pp : 319- 327(SCI & EI 02 2014)[link]
  • Shih-kang Lin*;Chao-kuei Yeh;Wei Xie;Yu-chen Liu;Masahiro Yoshimura,"Ab initio-aided CALPHAD thermodynamic modeling of the Sn-Pb binary system under current stressing",Scientific Reports;vol : 3, no : , pp : 2731- (SCI & EI 09 2013)[link]
  • Sinn-wen Chen*;Che-wei Hsu;Shih-kang Lin;Chia-ming Hsu,"Reaction evolution in Sn-20.0 wt. % In-2.8 wt. % Ag/Ni couples",Journal of Materials Research;vol : 28, no : , pp : 3257- 3260(SCI & EI 12 2013)[link]
  • Shih-kang Lin*;Chao-kuei Yeh;Brian Puchala;Yueh-Lin Lee;Dane Morgan,"Ab initio energetics of charge compensating point defects: A case study on MgO",Computational Materials Science;vol : 73, no : , pp : 41- 55(SCI & EI 06 2013)[link]
  • Shih-kang Lin;Che-wei Hsu;Sinn-wen Chen*;Chia-ming Hsu,"Interfacial reactions in Sn-20In-2.8Ag/Cu couples",Materials Chemistry and Physics;vol : 142, no : 1, pp : 268- 275(SCI & EI 10 2013)[link]
  • Sinn-wen Chen*;An-ren Zi;Wojciech Gierlotka;Ching-feng Yang;Chao-hong Wang;Shih-kang Lin;Chia-ming Hsu,"Phase equilibria of Sn–Sb–Cu system",Materials Chemistry and Physics;vol : 132, no : 2, pp : 703- 715(SCI & EI 02 2012)[link]
  • Shih-kang Lin;Kuen-da Chen;Hao Chen;Wei-kai Liou;Yee-wen Yen*,"Abnormal spalling phenomena in the Sn-0.7Cu/Au/Ni/SUS304 interfacial reactions",Journal of Materials Research;vol : 25, no : 12, pp : 2278- 2286(SCI & EI 12 2010)[link]
  • 陳信文*;許家銘;黃育智;林士剛;陳志銘;潘凱文,"無鉛銲料相關多元材料系統(Sn-Ag-Cu-Ni, Sn-In-Cu-Ni 及 Sn-In-Ag-Ni)之溼潤性,介面反應,相平衡與固化特性探討",; 工程科技通訊vol : 109, no : , pp : 65- 69(中華民國期刊論文 2010)[link]
  • Shih-kang Lin;Ting-ying Chung;Sinn-wen Chen*;Chih-horng Chang,"250 ℃ Isothermal Section of the Ternary Sn-In-Cu Phase Equilibria",Journal of Materials Research;vol : 24, no : 8, pp : 2628- 2637(SCI & EI 08 2009)[link]
  • Mary A. Miller;Shih-kang Lin;Suzanne E. Mohney*,"V/Al/V/Ag Contacts to n-GaN and n-Al0.58Ga0.42N",Journal of Applied Physics;vol : 104, no : , pp : 064508- (SCI & EI 09 2008)[link]
  • Shih-kang Lin;Ching-feng Yang;Shyr-harn Wu;Sinn-wen Chen*,"Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys",Journal of Electronic Materials;vol : 37, no : 4, pp : 498- 506(SCI & EI 04 2008)[link]
  • Sinn-wen Chen*;Chao-hong Wang;Shih-kang Lin;Chen-nan Chiu,"Phase Diagrams of Pb-Free Solders and their Related Materials Systems",Journal of Materials Science: Materials in Electronics;vol : 18, no : , pp : 19- 37(SCI & EI 01 2007)[link]
  • Wojcieh Gierlotka;Sinn-wen Chen*;Shih-kang Lin,"Thermodynamic Description of the Cu-Sn System",Journal of Materials Research;vol : 22, no : 11, pp : 3158- 3165(SCI & EI 11 2007)[link]
  • Sinn-wen Chen*;Chao-hong Wang;Shih-kang Lin;Chen-nan Chiu;Chih-chi Chen,"Phase Transformation and Microstructural Evolution in Solder Joints",Journal of Materials;, pp : 39- 43(SCI & EI 01 2007)[link]
  • Shih-kang Lin;Yuhi Yorikado;Junxiang Jiang;Keun-soo Kim;Katsuaki Suganuma;Sinn-wen Chen*;Masanobu Tsujimoto;Isamu Yanada,"Microstructure Development of Mechanical Deformation-induced Sn Whiskers",Journal of Electronic Materials;vol : 36, no : 12, pp : 1732- 1734(SCI & EI 12 2007)[link]
  • Shih-kang Lin;Yuhi Yorikado;Junxiang Jiang;Keun-Soo KIM;Katsuaki Suganuma;Sinn-wen Chen;Masanobu Tsujimoto;Isamu Yanada,"Mechanical Deformation-induced Sn Whiskers Growth on Electroplated Films in the Advanced Flexible Electronic Packaging",Journal of Materials Research;vol : 22, no : 7, pp : 1975- 1986(SCI & EI 07 2007)[link]
  • Shih-kang Lin;Sinn-wen Chen*,"Interfacial Reactions in the Sn-20at%In/Cu and Sn-20at%In/Ni Couples at 160 degree C",Journal of Materials Research;vol : 21, no : 7, pp : 1712- 1717(SCI & EI 07 2006)[link]
  • Sinn-wen Chen*;Shih-kang Lin,"Electric Current-induced Abnormal Cu/γ-InSn4 Interfacial Reactions",Journal of Materials Research;vol : 21, no : 12, pp : 3065- 3071(SCI & EI 12 2006)[link]
  • Sinn-wen Chen*;Shih-kang Lin,"Effects of Temperature on Interfacial Reactions in the γ-InSn4/Ni Couples",Journal of Materials Research;vol : 21, no : 5, pp : 1161- 1166(SCI & EI 05 2006)[link]
  • Sinn-wen Chen*;Shih-kang Lin;Ching-feng Yang,"Interfacial Reactions in the Pb-free Composite Solders with Indium Layers",Journal of Electronic Materials;vol : 35, no : 1, pp : 72- 75(SCI & EI 01 2006)[link]
  • 陳信文*;林士剛;周沁怡,"反應濕潤之探討",; 界面科學會誌vol : 26, no : 2, pp : 83- 88(中華民國期刊論文 02 2004)[link]
  • Sinn-wen Chen*;Shih-kang Lin;Jui-meng Jao,"Electromigration Effects upon Interfacial Reactions in the Flip-chip Solder Joints",Materials Transactions;vol : 45, no : 3, pp : 661- 665(SCI & EI 03 2004)[link]
  • Yu-chen Liu;Shih-kang Lin*,"Ab initio critical product of Blech distance and current density",2017 TMS Annual Meeting & Exhibition;( 02 2017)[link]
  • Ralph Nicolai V Nasara;Shih-kang Lin*;Ping-chun Tsai,"Defect engineering of Li4Ti5O12 anode with enhanced electrochemical properties for Li ion batteries by thermal reduction",2017 TMS Annual Meeting & Exhibition;( 02 2017)[link]
  • Che-yu Yeh;Yi-Kai Kuo;Shih-kang Lin*,"Ductile and strong Cu-to-Cu interconnection using Ga-based pastes for applications on 3D IC and WBG devices",2017 TMS Annual Meeting & Exhibition;( 02 2017)[link]
  • Shih-kang Lin*;Che-yu Yeh;Mei-jun Wang;Hao-miao Chang,"Ultra thermal stable Cu-to-Cu interconnection",2017 TMS Annual Meeting & Exhibition;( 02 2017)[link]
  • S.-G. Lin;Y.-H. Su;K.-L. Chang;S.-K. Lin*,"CALPHAD-assisted morphology control of manganese sulfide inclusions in free-cutting steels",CALPHAD XLV;( 05 2016)[link]
  • Shih-Kang Lin*;S. Nagao;E. Yokoi;C. Oh;H. Zhang;Y.-C. Liu;S.-G. Lin;K. Suganuma,"Silver nano-volcanic eruption: A CALPHAD un-puzzling",CALPHAD XLV;( 05 2016)[link]
  • Y.-C. Liu;Y.-S. Yu;S.-J. Chiu;Y.-T. Liu;H.-Y. Lee;S.-K. Lin*,"On the lattice stability of copper under current stressing",CALPHAD XLV The forty-fifth International Conference on CALPHAD (2016 CALPHAD XLV);( 05 2016)[link]
  • R.-N. Nasara;P.-C. Tsai;S.-K. Lin;K.-Z. Fung,"Novel synthesis of defect Li4Ti5O12 spinel with enhanced high-rate capability utilizing an ethanol thermal reduction process",2016 MRS Spring Meeting & Exhibit in Phoenix (2016 MRS);( 03 2016)[link]
  • Yeh Che-yu;Kuo Yi-kai;Lin Shih-kang*,"A novel approach for forming ductile Cu_to_Cu interconnection",2016 International Conference on Electronics Packaging (ICEP2016);( 04 2016)[link]
  • Shih-kang Lin*;Che-yu Yeh;Mei-jun Wang;Hao-miao Chang,"Ultra thermal stable Cu-to-Cu interconnection",2016 International Conference on Electronics Packaging (ICEP2016);( 04 2016)[link]
  • Hao Zhang*;Shijo Nagao;Shih-kang Lin;Emi Yokoi;Chuantong Chen;Katsuaki Suganuma,"A NOVEL MECHANISM OF SILVER MICROFLAKES SINTER JOINING",China Semiconductor Technology International Conference (CSTIC) 2016;( 03 2016)[link]
  • Chieh-Szu Huang;Shih-kang Lin*;Cheng-Liang Huang,"An Eco-friendly Red Phosphor with Very High Intensity",The 145th TMS Annual Meeting & Exhibition會議;( 02 2016)[link]
  • Yu-chen Liu;Yung-si Yu;Shang-Jui Chiu;Yen-Ting Liu;Hsin-Yi Lee;Shih-kang Lin*,"Why does electromigration occur? – A combinatorial study using ab initio calculations and synchrotron radiation diffractometry",The 145th TMS Annual Meeting & Exhibition會議;( 02 2016)[link]
  • Yu-cheng Chuang;Ping-chun Tsai;Shih-kang Lin*,"Why Does Li-rich Layered Oxide Cathode Material Degrade in Lithium Ion Batteries?",145th;( 02 2016)[link]
  • Katsuaki Suganuma*;Shoji Nagao;Toru Sugahara;Emi Yokoi;Hao Zhang;Jinting Jiu;Shih-kang Lin,"Silver Sinter Joining for WBG Die-attach",2016 MRS Spring Meeting & Exhibit in Phoenix (2016 MRS);( 03 2016)[link]
  • Chieh-szu Huang;Yi-Da Ho;Cheng-liang Huang;Shih-kang Lin*,"An Experimental and Computational Approach to Properties of Mg2TiO4: Mn+4 Red Emitting Phosphor",145th TMS Annual Meeting & Exhibition (TMS 2016);( 02 2016)[link]
  • Yu-cheng Chuang;Ping-chun Tsai;Shih-kang Lin*,"Ab Initio Mechanistic Study on the Charging/Discharging Behaviors of the Layered-layered Lithium-rich Composite Cathode for Lithium-ion Batteries",145th TMS Annual Meeting & Exhibition (TMS 2016);( 02 2016)[link]
  • C.-M. Wu;C.-C. Chang;P.-I. Pan;M. Avdeev;C.-P. Liu;Y.-W. Cheng;S.-K. Lin;P.-C. Tsai,"Understanding the inserted sodium in spherical carbon and hard carbon electrode of sodium ion battery",2016 綠色電化學科技學術研討會暨2016年台灣電化學學會年會;( 09 2016)[link]
  • Yu-chen Liu;Yung-si Yu;Shang-Jui Chiu;Yen-Ting Liu;Hsin-Yi Lee;Shih-kang Lin*,"A New Insight on the Electromigration Effect: Strain-induced Atomic Migration under Current Stressing",145th TMS Annual Meeting & Exhibition (TMS 2016);( 02 2016)[link]
  • Shih-kang Lin*;Shijo Nagao;Chulmin Oh;Hao Zhang;Yu-chen Liu;Shih-guei Lin;Katsuaki Suganuma,"Low-temperature pressure-less silver-to-silver direct bonding at ambient condition: Part II-Mechanistic study",145th TMS Annual Meeting & Exhibition (TMS 2016);( 02 2016)[link]
  • Shijo Nagao;Chulmin Oh;Shih-kang Lin*;Hao Zhang;Emi Yokoi;Takeshi Ishibashi;Katsuaki Suganuma,"Low-temperature pressure-less silver-to-silver direct bonding at ambient condition: Part I-Experimental study",145th TMS Annual Meeting & Exhibition (TMS 2016);( 02 2016)[link]
  • Yu-cheng Chuang;Ping-chun Tsai;Shih-kang Lin*,"Ab initio mechanistic study on the first charging behavior of the lithium-rich composite cathode material for lithium-ion batteries",62ndTaiwan Institute of Chemical Engineers Annual Meeting (TwIChE 2015);( 11 2015)[link]
  • Ralph Nicolai Nasara;Kuan-wei Lu;Yen-ting Pan;Ping-chun Tsai;Wei-chih Lin;Chung-ta Ni;Shih-kang Lin*;Kuan-zong Fung,"Defect engineering and electrochemical performance of Li4Ti5O12 defect spinel anode material utilizing a modified RAPET approach",62ndTaiwan Institute of Chemical Engineers Annual Meeting (TwIChE 2015);( 11 2015)[link]
  • Yu-chen Liu;Shang-Jui Chiu;Ching-Che Kao;Jey-Jau Lee;Shih-kang Lin*,"Critical voltage-drop induced atomic diffusion in Al stripes - An in situ synchrotron X-ray diffractometry study",62nd Taiwan Institute of Chemical Engineers Annual Meeting (TwIChE 2015);( 11 2015)[link]
  • Yu-chen Liu;Yung-si Yu;Shang-Jui Chiu;Yen-Ting Liu;Hsin-Yi Lee;Shih-kang Lin*,"Electric current-induced strain gradients and atomic migration: An in situ synchrotron radiation and ab initio study",2015 The Materials Research Society of Taiwan (MRS-T);( 11 2015)[link]
  • Shih-kang Lin*;Yu-chen Liu;Che-yu Yeh;Yung-si Yu,"Alloy Phase Stability and Phase Equilibria under Electric Current Stressing",2015 The Materials Research Society of Taiwan (MRS-T);( 11 2015)[link]
  • Shih-guei Lin;Shih-kang Lin*;Yen-hao Su,"快削鋼中硫化錳介在物之形貌控制技術開發",International Seminar of Investment Casting (ISIC);( 10 2015)[link]
  • Chieh-szu Huang;Yi-Da Ho;Cheng-liang Huang;Shih-kang Lin*,"Non-Rare Earth Mg2TiO4: Mn+4 Red Emitting Phosphor: A combined Experimental and Ab Initio Study",The IMPACT 2015 conference;( 10 2015)[link]
  • Hseng-ming Liao;Che-yu Yeh;Ting-chien Wang;Stuwart Fan;Futton Chu;Louie Huang;Shih-kang Lin*,"Effects of Ni, Co, Bi-co-doping upon Sn-Ag-Cu solder/Cu joints",The IMPACT 2015 conference;( 10 2015)[link]
  • Yu-chen Liu;Yung-si Yu;Shang-Jui Chiu;Yen-Ting Liu;Hsin-Yi Lee;Shih-kang Lin*,"On the mechanism of electromigration effect: An in-situ synchrotron radiation and ab initio study",The IMPACT 2015 conference;( 10 2015)[link]
  • Shih-kang Lin*;Ping-chun Tsai;Wen-Dung Hsu,"Ab initio-aided Li4Ti5O12 defect spinel electrode materials designs for durable lithium ion batteries",The 66th International Society of Electrochemistry Annual Meeting;( 10 2015)[link]
  • Yu-cheng Chuang;Ping-chun Tsai;Shih-kang Lin*,"Ab initio lattice stability of the xLi2MnO3-(1-x)Li(Ni1/3Mn1/3Co1/3)O2 composite-layered cathode materials for lithium-ion batteries",The 66th International Society of Electrochemistry Annual Meeting;( 10 2015)[link]
  • Ralph Nicolai Nasara;Kuan-wei Lu;Yen-ting Pan;Ping-chun Tsai;Wei-chih Lin;Chung-ta Ni;Shih-kang Lin*;Kuan-zong Fung,"A modified RAPET approach to Li4Ti5O12 defect spinel nanoparticles as anode material for lithium ion batteries",The 66th International Society of Electrochemistry Annual Meeting;( 10 2015)[link]
  • Yu-cheng Chuang;Ping-chun Tsai;Shih-kang Lin*,"Theoretical mechanistic investigation on the first charging behaviors of xLi2MnO3",5th international symposium on advance ceramics and Technology for Sustainable Energy Applications Toward a Low Carbon Society (2015 ACTSEA);( 11 2015)[link]
  • Katsuaki Suganuma*;Shijo Nagao;Takeshi Sugahara;Jinting Jiu;Emi Yokoi;Hao Zhang;Shih-kang Lin,"Nanoparticle or Microparicle sintering for 3D/Power Assembly?",The 10th IEEE Nanotechnology Materials and Devices Conference (NMDC 2015);( 09 2015)[link]
  • Mei-jun Wang;Hao-miao Chang;Shih-kang Lin*,"A novel Ga-based Cu-to-Cu bonding approach for 3D IC packaging",144th TMS Annual Meeting & Exhibition;( 03 2015)[link]
  • Yu-chen Liu;Shang-Jui Chiu;Ching-Che Kao;Jey-Jau Lee;Shih-kang Lin*,"Why is electromigration not observed below the “Blech distance”?- An in situ synchrotron radiation study",The 21st NSRRC Users' Meeting & Workshops;( 09 2015)[link]
  • Yu-chen Liu;Yung-si Yu;Shang-Jui Chiu;Yen-Ting Liu;Hsin-Yi Lee;Shih-kang Lin*,"Electric current-induced strain gradients and atomic migration: An in situ synchrotron radiation and ab initio study",The 21st NSRRC Users' Meeting & Workshops;( 09 2015)[link]
  • Chieh-szu Huang;Yi-Da Ho;Cheng-Liang Huang;Shih-kang Lin*,"An Experimental and Computational Approach to Properties of Mg2TiO4: Mn+4 Red Emitting Phosphor",2015 Taiwan Phase Diagrams Meeting (TAPHAD);( 09 2015)[link]
  • Shih-guei Lin;Shih-kang Lin*,"Thermodynamic study of MnS inclusion formation in steel",2015 Taiwan Phase Diagrams Meeting (TAPHAD);( 09 2015)[link]
  • Ralph Nicolai Nasara;Yu-cheng Chuang;Kuan-wei Lu;Yen-ting Pan;Ping-chun Tsai;Wei-chih Lin;Chung-ta Ni;Shih-kang Lin*;Wen-Dung Hsu;Kuan-zong Fung,"Ab initio materials design and modified-RAPET syntheses of lithium titanate anode for rechargeable batteries",2015 Taiwan Phase Diagrams Meeting (TAPHAD);( 09 2015)[link]
  • Yu-chen Liu;Shih-kang Lin*,"Research activities in NEXT-G Materials Design",2015 Taiwan Phase Diagrams Meeting (TAPHAD);( 09 2015)[link]
  • Shih-kang Lin*;Guan-ling Ou;Yen-hao Su;Mu-jung Lu,"Interfacial reactions between high-Mn high-Al steels and continuous casting mold fluxes",The 4th Cross-strait Green Materials & Green Processing Forum;( 09 2015)[link]
  • Muhammad Anshar Makhraja;Shih-kang Lin*,"Ab initio-aided thermodynamic reassessment of the Mo-Zr binary system",The 8th Conference of Asian Consortium on Computational Materials Science (ACCMS-8);( 06 2015)[link]
  • Shu-chang Wu;Ki-lin Cheng;Chuan Zhang;Shih-kang Lin*,"Re-assessment of the Mo-Nb, Mo-Re, and Nb-Re binary systems.",144th TMS Annual Meeting & Exhibition;( 03 2015)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-Dung Hsu,"An ab initio-aided experimental investigation on W-doped Li4Ti5O12 defect spinel as anodes for Li ion batteries.",144th TMS Annual Meeting & Exhibition;( 03 2015)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-Dung Hsu,"Ab initio physical and electrochemical properties of Kr",144th TMS Annual Meeting & Exhibition;( 03 2015)[link]
  • Shih-kang Lin*;Yu-chen Liu,"Phase stability of Sn-Pb, Sn-Cu and Sn-Ag binary systems under current stressing.",144th TMS Annual Meeting & Exhibition;( 03 2015)[link]
  • Yi-kai Kuo;Trong Lan Nguyen;Shih-kang Lin*,"Interfacial reactions in Sn-0.7Cu-xGa/Cu joints and phase equilibria of the Cu-Ga-Sn ternary system at 200 °C.",144th TMS Annual Meeting & Exhibition;( 03 2015)[link]
  • Ping-chun Tsai;Wen-dung Hsu;Shih-kang Lin*,"Ab initio-aided defect spinel electrode design for lithium ion batteries with high cyclability",CALPHAD XLIII 2014;( 06 2014)[link]
  • Yu-hsiang Wang;Hui-chin Kuo;Shih-kang Lin*,"Interfacial reactions in the Cu/In/Ni thermal management module",International Union of Materials Research Societies - International Conference on Electronic Materials 2014 (IUMRS-ICEM 2014);( 06 2014)[link]
  • Yi-kai Kuo;Trong-lan Nguyen;Shih-kang Lin*,"Interfacial reactions between Sn-0.7Cu-xGa solders and Cu substrates and phase equilibria of the Cu-Ga-Sn ternary system at 200 oC",International Union of Materials Research Societies - International Conference on Electronic Materials 2014 (IUMRS-ICEM 2014);( 06 2014)[link]
  • Hao-miao Chang;Cheng-liang Cho;Shih-kang Lin*,"A novel Ga-based Cu-to-Cu TSV interconnection with Pt UBM",International Union of Materials Research Societies - International Conference on Electronic Materials 2014 (IUMRS-ICEM 2014);( 06 2014)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"Ab Initio study on nature's missing Li4Me5O12 defect spinel oxides",International Union of Materials Research Societies - International Conference in Asia 2014 (IUMRS-ICA 2014);( 08 2014)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"Optimized Li4Me5O12 defect spinel electrode materials for lithium ion batteries using ab initio calculations",International Union of Materials Research Societies - International Conference in Asia ( IUMRS-ICA 2014);( 08 2014)[link]
  • Shih-kang Lin*,"Electric current effects upon electronic solder joints",International Union of Materials Research Societies - International Conference in Asia (IUMRS-ICA 2014);( 08 2014)[link]
  • Hao-miao Chang;Mei-jun Wang;Cheng-liang Cho;Shih-kang Lin*,"A novel Ga-based Cu-to-Cu Bonding Technology in 3D IC Interconnections",International Microsystems, Packaging, Assembly, Circuits Technology (IMPACT);( 10 2014)[link]
  • Shu-chang Wu;Yen-hao Su;Shi-gui Lin;Shih-kang Lin*,"高合金鋼連續鑄造之高溫熱機械性質量測與CALPHAD熱力學解析",CIMME;( 10 2014)[link]
  • Ping-chun Tsai;Wen-dung Hsu;Shih-kang Lin*,"Ab initio-aided defect spinel electrode design for durable lithium ion batteries",International Union of Materials Research Societies - International Conference of Young Researchers on Advanced Materials (IUMRS-ICYRAM);( 10 2014)[link]
  • Shu-chang Wu;Yen-hao Su;Shi-gui Lin;Shih-kang Lin*,"Fe-Al-Mn-Si-C五元系統之熱力學模型建構及應用",International Seminar of Investment Casting (ISIC);( 11 2014)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"Ab Initio study on nature's missing Li4Me5O12 defect spinel oxides",PSROC Annual Meeting;( 01 2014)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"Li4Me5O12 defect spinel oxides as new electrode materials for lithium ion batteries by ab initio calculation",13th Workshop on First-Principles Computational Materials Physics;( 02 2014)[link]
  • Shu-chang Wu;Chi-lin Cheng;Shih-kang Lin*;Zhang Chuan,"第一原理輔相圖計算建構鈮錸二元系統熱力學模型",13th Workshop on First-Principles Computational Materials Physics;( 02 2014)[link]
  • Shih-kang Lin*;Chao-kuei Yeh;Yu-chen Liu;Masahiro Yoshimura,"Why does an Electric Current Change the Stability of Solder",13th Workshop on First-Principles Computational Materials Physics;( 02 2014)[link]
  • Shih-kang Lin*;Chao-kuei Yeh;Yu-chen Liu;Masahiro Yoshimura,"Why Does an Electric Current Change the Stability of Solder",143rd TMS Annual Meeting & Exhibition (TMS 2014);( 02 2014)[link]
  • Yu-hsiang Wang;Shih-kang Lin*,"Characterization of Interfacial Reactions in Cu/In/Ni Joints at 280 oC",143rd TMS Annual Meeting & Exhibition (TMS 2014);( 02 2014)[link]
  • Ming-yueh Tsai;Shih-kang Lin*,"Periodic Layer Formation in the Au-12Ge/Ni Diffusion Couple",143rd TMS Annual Meeting & Exhibition (TMS 2014);( 02 2014)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"Exploring Nature's Missing Li4Me5O12 Defect Spinel Oxides by Ab Initio Calculations",143rd TMS Annual Meeting & Exhibition (TMS 2014);( 02 2014)[link]
  • Guan-ling Ou;Yen-hao Su;Shih-kang Lin*;Mu-jung Lu,"高合金鋼連鑄鑄粉開發",International Seminar of Investment Casting (ISIC);( 11 2014)[link]
  • Hao-miao Chang;Shih-kang Lin*,"Ga-based Cu-to-Cu Interconnection with Pt UBM",143rd TMS Annual Meeting & Exhibition (TMS 2014);( 02 2014)[link]
  • Wen-dung Hsu;Chu-wei Liu;Tsung-chuan Wu;Zary Adabavazeh;Tsang-tse Fang;Shih-kang Lin*,"Nonstoichiometry of pristine, La-doped, and La/Cr-co-doped BiFeO3: Solid-state syntheses, characterization, and first-principle calculations",International Union of Materials Research Societies - International Conference on Electronic Materials 2014 (IUMRS-ICEM 2014);( 06 2014)[link]
  • Yu-hsiang Wang;Hui-chin Kuo;Shih-kang Lin*,"Characterization of Interfacial Reactions in Cu/In/Ni Joints at 280 oC",143rd TMS Annual Meeting & Exhibition (TMS 2014);( 02 2014)[link]
  • Hao-miao Chang;Cheng-liang Cho;Yi-kai Kuo;Shih-kang Lin*,"Ga-based Cu-to-Cu Interconnection with Pt UBM",143rd TMS Annual Meeting & Exhibition (TMS 2014);( 02 2014)[link]
  • Ming-yueh Tsai;Shih-kang Lin*,"Periodic Layer Formation in the Au-12Ge/Ni Diffusion Couple",143rd TMS Annual Meeting & Exhibition (TMS 2014);( 02 2014)[link]
  • Trong-lan Nguyen;Shih-kang Lin*,"Periodic Layer Formation in the Au-12Ge/Ni Diffusion Couple",143rd TMS Annual Meeting & Exhibition (TMS 2014);( 02 2014)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"Exploring Nature's Missing Li4Me5O12 Defect Spinel Oxides by Ab Initio Calculations",143rd TMS Annual Meeting & Exhibition (TMS 2014);( 02 2014)[link]
  • Shih-kang Lin*;Chao-kuei Yeh;Wei Xie;Yu-chen Liu;Masahiro Yoshimura,"Why Does an Electric Current Change the Stability of Solder",143rd TMS Annual Meeting & Exhibition (TMS 2014);( 02 2014)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"Ab initio screening of 3d transition metal-doped Li4Ti5O12 defect spinel anodes for Li ion batteries",2014 Chinese Ceramic Society Annual Meeting;( 05 2014)[link]
  • Shu-chang Wu;Chi-lin Cheng;Zhang Chuan;Shih-kang Lin*,"Ab initio-aided CALPHAD modeling for the Mo-Nb-Re ternary system",CALPHAD XLIII 2014;( 06 2014)[link]
  • Trong Lan Nguyen;Shih-kang Lin*,"Effective retardation of Sn-58Bi/Cu interfacial reactions with minor Ga addition",8th IMPACT Conference;( 10 2013)[link]
  • Yu-hsiang Wang;Shih-kang Lin*,"Interfacial reactions in the Cu/In/Ni sandwich couples at 280 °C",8th IMPACT Conference;( 10 2013)[link]
  • Chao-kuei Yeh;Yu-chen Liu;Mei-jun Wang;Shih-kang Lin*,"On the non-polarity effects Of the Bi/Ni interfaces under current stressing",8th IMPACT Conference;( 10 2013)[link]
  • Yi-kai Kuo;Cheng-liang Cho;Yu-chen Liu;Shih-kang Lin*,"Reactive Wetting of Molten Ga solder on Poly-crystalline, Single-crystalline and Pt-coated Cu Substrates",8th IMPACT Conference;( 10 2013)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"Structural and electrical properties of 3d transition metal-doped Li4Ti5O12 defect spinel by ab initio calculations",2013 Chinese Institute of Mining and Metallurgical Engineering Annual meeting (CIMME 2013);( 10 2013)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"An ab initio study on transition metal doped Li4M0.125Ti4.875O12 defect spinel (M = Zr, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Ni, Cu, and Zn) as anode materials in lithium ion batteries",4th International Symposium on Advanced Ceramics and Technology for Sustainable Energy Applications toward a Low Carbon Society (ACTSEA 2013);( 11 2013)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"Designing the doped Li4Ti5O12 anode materials with long cycle life and high-rate by ab initio calculations",2013 Materials Research Society-Fall Annual Meeting (MRS-Fall 2013);( 12 2013)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"Ab initio screening of electronic structures and electrochemical properties of transition metal-doped Li4Ti5O12 defect spinel as anode materials in lithium ion batteries",5th PCGMR symposium on Nano-Technology/-Materials for Energy, Electronics and Others (PCGMR 2013);( 12 2013)[link]
  • Ming-yueh Tsai;Shih-kang Lin*,"Formation of alternating interfacial layers in the Au-12Ge/Ni joints",The 8th IMPACT Conference;( 10 2013)[link]
  • Shu-chang Wu;Chi-lin Cheng;Zhang Chuan;Shih-kang Lin*,"Ab initio-aided CALPHAD of NbRe System",5th PCGMR symposium on Nano-Technology/-Materials for Energy, Electronics and Others (PCGMR 2013);( 12 2013)[link]
  • Chao-kuei Yeh;Shih-kang Lin*,"Supersaturation and phase stability of Pb-Sn alloys under current stressing",142nd TMS Annual Meeting & Exhibition (TMS 2013);( 03 2013)[link]
  • Shih-kang Lin*;Chao-kuei Yeh;Yu-chen Liu;Masahiro Yoshimura,"Why Does an Electric Current Change the Stability of Solder",5th PCGMR symposium on Nano-Technology/-Materials for Energy, Electronics and Others (PCGMR 2013);( 12 2013)[link]
  • Hao-miao Chang;Cheng-liang Cho;Yi-kai Kuo;Shih-kang Lin*,"A novel Ga-based TSV interconnection with Pt UBM",The 8th IMPACT Conference;( 10 2013)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-Dung Hsu,"The ab initio study on structural and electrical properties of the doped Li4Ti5O12 anode for Li ion batteries",2013 Materials Research Society-Taiwan Annual Meeting (MRS-T 2013);( 10 2013)[link]
  • Ming-yueh Tsai;Shih-kang Lin*,"Alternating reaction layer formation in the Au-12Ge/Ni joints",2013 Materials Research Society-Taiwan Annual Meeting (MRS-T 2013);( 10 2013)[link]
  • Yu-ching Chang;Bo-hsun;Shih-kang Lin*,"Interfacial reaction between Au-Ge solders and Cu substrates",2013 Materials Research Society-Taiwan Annual Meeting (MRS-T 2013);( 10 2013)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-dung Hsu,"Atomistic structures of the lithium titanate spinel oxides: An ab initio study",2013 Chinese Ceramic Society Annual Meeting;( 05 2013)[link]
  • Ping-chun Tsai;Shih-kang Lin*;Wen-Dung Hsu,"Doping effects upon the Li4Ti5O12 spinel as anode materials in Li ion batteries,",2013 Chinese Chemistry Society (Kaohsuing branching) Annual meeting;( 05 2013)[link]
  • Cheng-liang Cho;Shih-kang Lin*,"Interfacial reactions in the Cu/Ga/Cu sandwich joints",142nd TMS Annual Meeting & Exhibition (TMS 2013);( 03 2013)[link]
  • Bo-hsun Hsu;Shih-kang Lin*,"Interfacial reactions between Au-Ge eutectic solders and Cu substrates",142nd TMS Annual Meeting & Exhibition (TMS 2013);( 03 2013)[link]
  • Bo-hsun Hsu;Shih-kang Lin*,"Interfacial reactions between molten Au-Ge eutectic alloy and Cu substrate at 400oC",Visual-JW 2012;( 11 2012)[link]
  • Chao-kuei Yeh;Shih-kang Lin*,"第一原理輔助熱力學計算探討電遷移效應對相穩定性之影響",2012 Materials Research Society-Taiwan Annual Meeting (MRS-T 2012);( 11 2012)[link]
  • Tronglan Nguyen;Shih-kang Lin*,"100oC isothermal section of the Bi-Ga-Sn ternary system",4th PCGMR symposium on Nano-Technology/Materials for Bio-Medical Application (PCGMR2012);( 11 2012)[link]
  • Bo-hsun Hsu;Shih-kang Lin*,"Soldering reactions between Au-Ge high temperature Pb-free solders and Cu substrates",7th IMPACT Conference (iMPACT 2012);( 10 2012)[link]
  • Cheng-liang Cho;Shih-kang Lin*,"Novel Ga-based Cu-to-Cu interconnection in 3D IC technology",7th IMPACT Conference (iMPACT 2012);( 10 2012)[link]
  • Brian Puchala;Shih-kang Lin;Ligen Wang;Dane Morgan*,"PEMFC Nanoparticle Dealloying from Kinetic Monte Carlo Simulations",Pacific RIM Meeting on Electrochemical and Solid-state Sciecne (PRiME 2012);( 10 2012)[link]
  • Shih-kang Lin*;Brain Puchala;Yueh-Lin Lee;Dane Morgan,"Ab initio energetics of charge compensating point defects",International Union of Materials Research Society - International Conference on Electronic Materials (IUMRS-ICEM 2012);( 09 2012)[link]
  • Dane Morgan*;Yueh-Lin Lee;Brian Puchala;Ligen Wang;Shih-kang Lin,"Atomistic-Based Approaches for Modeling Activity and Degradation in Fuel Cell Catalysts",American Chemical Society Fall Meeting (ACS 244th meeting);( 08 2012)[link]
  • Brian Puchala;Shih-kang Lin;Ligen Wang;Dane Morgan*,"Kinetic Monte Carlo Simulations of Pt1-xCox Nanoparticle Catalyst Dealloying",11st Spring Meeting of the International Society of Electrochemistry;( 05 2012)[link]
  • Cheng-liang Cho;Shih-kang Lin*,"Novel Ga-based Cu-to-Cu interconnection in 3D IC technology",Visual-JW 2012;( 11 2012)[link]
  • Shih-kang Lin;Sinn-wen Chen,"Phase equilibria and solidification of ternary Sn-In-Cu alloys",141st TMS Annual Meeting & Exhibition (TMS 2012);( 03 2012)[link]
  • Shih-kang Lin;Dane Morgan*,"Full compound energy formalism CALPHAD modeling coupled with first principle calculation for ionic materials",CALPHAD XL;( 05 2011)[link]
  • Shih-kang Lin;Dane Morgan*,"Ab initio-aided CALPHAD thermodynamic modeling of ionic systems: Application to La1-yMnO3±δ",140th TMS Annual Meeting & Exhibition (TMS 2011);( 02 2011)[link]
  • Shih-kang Lin;Dane Morgan*;Y.-L. Lee,"Ab initio energetics of charge compensating point defects: a case study on MgO",Materials Science & Technology 2010 (MS&T 2010);( 10 2010)[link]
  • W. Gierlotka;Sinn-wen Chen;Shih-kang Lin,"Theromodynamic Modeling of Cu-In-Sn Ternary System",138th TMS Annual Meeting & Exhibition (TMS 2009);( 02 2009)[link]
  • Shih-kang Lin;Sinn-wen Chen,"Liquation Phenomena in the Sn-In/Ni Interfacial Reactions",136th TMS Annual Meeting & Exhibition (TMS 2007);( 02 2007)[link]
  • Shih-kang Lin;Y. Yorikado;J.-X. Jiang;K.-S. Kim;K. Suganuma;Sinn-wen Chen,"Mechanical Deformation-induced Sn Whisker Formation and Microstructure Development in Electroplated Films",136th TMS Annual Meeting & Exhibition (TMS 2007);( 02 2007)[link]
  • Sinn-wen Chen;C.-N. Chiu;Shih-kang Lin;C.-H. Wang;C.-F Yang,"Interfacial Reactions and Phase Diagrams of Pb-Free Solders and Related Materials Systems",136th TMS Annual Meeting & Exhibition (TMS 2007);( 02 2007)[link]
  • Sinn-wen Chen;S.-H. D. Wong;C.-M. Hsu;C.-H. Wang;Shih-kang Lin;Y.-C. Huang,"Effects of Electromigration on Interfacial Reactions",136th TMS Annual Meeting & Exhibition (TMS 2007);( 02 2007)[link]
  • Shih-kang Lin;Y. Yorikado;K.-S. Kim;K. Suganuma;Sinn-wen Chen;M. Tsujimoto;I. Yanada,"Sn Whiskers Growth on Electroplated Lead-free Solder Finish for Advanced Flexible Electronic Packaging",2006 Sanken International Symposium on Nanoscience and Nanotechnology (SISNN-2006);( 09 2006)[link]
  • Shih-kang Lin;Sinn-wen Chen,"A Mechanism Study on Sn Whisker Growth on Electroplated Finishes in Advanced Flexible Electronic Packaging",53rd Taiwan Institute of Chemical Engineers Annual Meeting (TwIChE 2006);( 11 2006)[link]
  • Shih-kang Lin;Sinn-wen Chen,"Current Direction Effects upon Interfacial Reactions in the Sn-In/Cu Joints",135th TMS Annual Meeting & Exhibition (TMS 2006);( 03 2006)[link]
  • Shih-kang Lin;Sinn-wen Chen,"Electromigration-induced High Reactive Diffusion Path in Sn-In/Cu Joints",135th TMS Annual Meeting & Exhibition (TMS 2006);( 03 2006)[link]
  • Y.-C. Huang;Sinn-wen Chen;Shih-kang Lin;C.-H. Chang;J.-C. Wu,"Heat Treatment of the Thermal Spray Objects",135th TMS Annual Meeting & Exhibition;( 03 2006)[link]
  • Sinn-wen Chen;C.-N. Chiu;C.-H. Wang;Shih-kang Lin;C.-C. Chen,"Interfacial Reactions and Phase Diagrams in the Pb-free Solder Joints",2006 Materials Research Society-Taiwan Annual Meeting (MRS-T 2006);( 11 2006)[link]
  • Shih-kang Lin;Sinn-wen Chen,"Liquidus Projection and Solidification of the Sn-In-Cu Ternary Alloys",2006 International Microelectronic and Packaging Society-Taiwan (IMAPS-Taiwan 2006);( 06 2006)[link]
  • Sinn-wen Chen;Shih-kang Lin;C.-N. Chiu;Y.-C. Huang,"Electromigration Effects upon Interfacial Reactions in the Pb-free Solder Joints",2006 International Conference on Chemical and Molecular Technologies;( 12 2006)[link]
  • Shih-kang Lin;Sinn-wen Chen,"Electric Current Direction Effects upon the In-Sn/Cu Interfacial Reactions",2005 Materials Research Society-Taiwan Annual Meeting (MRS-T 2005);( 11 2005)[link]
  • Shih-kang Lin;Sinn-wen Chen,"Electric Current Direction Effects upon the In-Sn/Cu Interfacial Reactions",2005 Materials Research Society-Taiwan Annual Meeting (MRS-T 2005);( 11 2005)[link]
  • Shih-kang Lin;Sinn-wen Chen,"Electric Current Direction Effects upon the In-Sn/Cu
  • Sinn-wen Chen*;Wojciech Gierlotka;Hsin-jay Wu;Shih-kang Lin,"Lead-free Solders: Materials Reliability for Electronics",[link]