成功大學材料系
EN
專任教授

專任教授

林光隆
林光隆

專任教授

林光隆講座教授

聯絡電話: (06) 275-7575 ext.62929
電子信箱:matkllin@mail.ncku.edu.tw
實驗室:電子構裝實驗室
個人網站:
網站連結
研究專長:材料表面工程、電子構裝材料與技術、銲錫材料與技術
學術成大:

期刊論文

  1. Ying-Ta Chiu*;Kwang-Lung Lin;Albert T. Wu;Wei-Luen Jang;Chung-Li Dong;Yi-Shao Lai,"Electrorecrystallization of Metal Alloy",J Alloy and Compound;vol : 549, no : , pp : 190- 194(SCI 01 2013)[link]
  2. Yu-Wei Lin*;Kwang-Lung Lin,"Nucleation behaviors of the intermetallic compounds at the initial interfacial reaction between the liquid Sn3.0Ag0.5Cu solder and Ni substrate during reflow",Intermetallics;vol : 32, no : , pp : 6- 11(SCI 01 2013)[link]
  3. Nai-Shuo Liu*;Kwang-Lung Lin,"Effect of Ga on the Oxidation Properties of Sn–8.5Zn–0.5Ag–0.1Al–xGa Solders",Oxidation of Metals;vol : 78, no : 5-6, pp : 285- 294(SCI 12 2012)[link]
  4. Kwang-Lung Lin*;Yu-Wei Lin;Chang-Ho Yu,"The Interphases Formed During the Very Early Stage Liquid Solder/Metal Substrate Interaction of the Soldering Process",JOM (The Journal of The Minerals, Metals & Materials Society );vol : 64, no : 10, pp : 1184- 1189(SCI 10 2012)[link]
  5. Wei-Yu Chen*;Tsung-Chieh Chiu;Kwang-Lung Lin;Yi-Shao Lai,"Electrorecrystallization of intermetallic compound in the Sn0.7Cu solder joint",Intermetallics;vol : 26, no : , pp : 40- 43(SCI 07 2012)[link]
  6. Jagjiwan Mittal;Kwang Lung Lin*,"Diffusion of Cu and interfacial reactions during reflow of Sn–8.5Zn–0.5Ag–0.01Al–0.1Ga alloy on Ni/Cu substrate",Journal of Materials Research;vol : 27, no : 8, pp : 1142- 1148(SCI 04 2012)[link]
  7. Wei-Luen Jang;Tai-Siang Wang;Yen-Fen Lai;Kwang-Lung Lin*;Yi-Shao Lai,"The performance and fracture mechanism of solder joints under mechanical reliability test",Microelectronics Reliability;, pp : http://dx.doi.org/10.1016/j.mi- (SCI 04 2012)[link]
  8. Ying-Ta Chiu;Kwang-Lung Lin*;Yi-Shao Lai,"Dissolution of Sn in a SnPb solder bump under current stressing",Journal of Applied Physics;vol : 111, no : , pp : 043517- (SCI 02 2012)[link]
  9. Tsung-Chieh Chiu*;Kwang-Lung Lin,"The Growth of Intermetallic Compound in Cu/Sn3.5Ag/Au Solder Joints under Current Stressing",Intermetallics;vol : 23, no : , pp : 208- 216(SCI 04 2012)[link]
  10. YU-HSIANG HSIAO*;KWANG-LUNG LIN;CHIU-WEN LEE;YU-HSIU SHAO;YI-SHAO LAI,"Study of Electromigration-Induced Failures on Cu Pillar Bumps Joined to OSP and ENEPIG Substrates",Journal of Electronic Materials;vol : 41, no : 12, pp : 3368- 3374(SCI 12 2012)[link]
  11. De-Shin Liu;Chang-Lin Hsu*;Chia-Yuan Kuo;Ya-Ling Huang;Kwang-Lung Lin;Geng-Shin Shen,"A novel high speed impact testing method for evaluating the low temperature effects of eutectic and lead-free solder joints",Soldering & Surface Mount Technology;vol : 24, no : 1, pp : 22- 29(SCI 01 2012)[link]
  12. P. J. Tsai;T. C. Chiu;P. H. Tsai;K. L. Lin;K. S. Lin;S. L. I. Chan*,"Carbon nanotube buckypaper/MmNi5 composite film as anode for Ni/MH batteriesCarbon nanotube buckypaper/MmNi5 composite film as anode for Ni/MH batteries",International Journal of Hydrogen Energy;vol : 37, no : 4, pp : 3494- 3499(SCI 02 2012)[link]
  13. Ying-Ta Chiu*;Chia-Hao Liu;Kwang-Lung Lin;Yi-Shao Lai,"Supersaturation Induced by Current Stressing",Scripta Materialia;vol : 65, no : , pp : 615- 617(SCI 07 2011)[link]
  14. Jagjiwan Mittal;Kwang Lung Lin*,"The formation of electric circuits with carbon nanotubes and copper using tin solder",CARBON;vol : 49, no : , pp : 4385- 4391(SCI 06 2011)[link]
  15. Chau, J.L.H.;Chen, C.-Y.;Yang, M.-C.;Lin, K.-L.;Sato, S.;Nakamura, T.;Yang, C.-C.;Cheng, C.-W.,"Femtosecond laser synthesis of bimetallic Pt-Au nanoparticles",Materials Letters;vol : 65, no : 4, pp : 804- 807(SCI 02 2011)[link]
  16. Wei-Luen Jang*;Tsung-Chieh Chiu;Kwang-Lun Lin,"Effect of Thermal Cycles on Adhesion Strength of Ag/Ni/Ti film on AlN Substrate",Thin Solid Films;vol : 519, no : 16, pp : 5539- 5543(SCI 06 2011)[link]
  17. Chien-Cheng Pan;Kwang-Lung Lin,"The interfacial amorphous double layer and the homogeneous nucleation in reflow of a Sn-Zn solder on Cu substrate",JOURNAL OF APPLIED PHYSICS;vol : 109, no : 103513, pp : 103513-1- 103513-4(SCI2011)[link]
  18. Yu-Wei Lin;Kwang-Lung Lin,"The early stage dissolution of Ni and the nucleation of Ni-Sn intermetallic compound at the interface during the soldering of Sn-3.5Ag on a Ni substrate",JOURNAL OF APPLIED PHYSICS; JOURNAL OF APPLIED PHYSICSvol : 108, no : 6, pp : 063536- (SCI 09 2010)[link]
  19. Y.L. Huang;K.L. Lin;D.S. Liu,"Microstructure evolution and microimpact performance of Sn-Ag-Cu solder joints under thermal cycle test",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 25, no : 7, pp : 1312- 1320(SCI 07 2010)[link]
  20. J. Mittal;K.L. Lin,"Activities during melting and reflowing behaviour of solders",Soldering & Surface Mount Technology;Soldering & Surface Mount Technologyvol : 22, no : 1, pp : 4- 10(SCI2010)[link]
  21. Jagjiwan Mittal;Yu Wei Lin;Kwang Lung Lin,"Influence of Cu substrate surface oxides and heating rates during reflow on melting point of Sn–3.5Ag solder",Applied Surface Science; Applied Surface Sciencevol : 256, no : 11, pp : 3531- 3540(SCI 03 2010)[link]
  22. Chiu TC;Lin KL,"The difference in the types of intermetallic compound formed between the cathode and anode of an Sn-Ag-Cu solder joint under current stressing",INTERMETALLICS; INTERMETALLICSvol : 17, no : 12, pp : 1105- 1114(SCI 12 2009)[link]
  23. Kuo SM;Lin KL,"Recrystallization under electromigration of a solder alloy",JOURNAL OF APPLIED PHYSICS; JOURNAL OF APPLIED PHYSICSvol : 106, no : 2, pp : 023514- (SCI 07 2009)[link]
  24. Chiu TC;Lin KL,"The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint",SCRIPTA MATERIALIA; SCRIPTA MATERIALIAvol : 60, no : 12, pp : 1121- 1124(SCI 06 2009)[link]
  25. Hsuan TC;Lin KL,"Microstructural evolution of epsilon-AgZn3 and eta-Zn phases in Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga solder during aging treatment",JOURNAL OF ALLOYS AND COMPOUNDS; JOURNAL OF ALLOYS AND COMPOUNDSvol : 469, no : 1-2, pp : 350- 356(SCI 02 2009)[link]
  26. Wu YK;Lin KL;Salam B,"Specific Heat Capacities of Sn-Zn-Based Solders and Sn-Ag-Cu Solders Measured Using Differential Scanning Calorimetry",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 38, no : 2, pp : 227- 230(SCI 02 2009)[link]
  27. Lai RS;Lin KL;Salam B,"Suppressing Growth of the Cu5Zn8 Intermetallic Layer in Sn-Zn-Ag-Al-Ga/Cu Solder Joints",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 38, no : 1, pp : 88- 92(SCI 01 2009)[link]
  28. Mittal J;Kuo SM;Lin YW;Lin KL,"Diffusion Behavior of Zn During Reflow of Sn-9Zn Solder on Ni/Cu Substrate",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 38, no : 12, pp : 2436- 2442(SCI 12 2009)[link]
  29. Yeh TK;Lin KL;Salam B,"Improving high-temperature oxidation behaviour of Sn-Zn-Ag-Al-Ga solders",SOLDERING & SURFACE MOUNT TECHNOLOGY; SOLDERING & SURFACE MOUNT TECHNOLOGYvol : 21, no : 4, pp : 19- 23(SCI2009)[link]
  30. Kuo SM;Lin KL,"Electromigration-induced void formation at the Cu5Zn8/solder interface in a Cu/Sn-9Zn/Cu sandwich",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 37, no : 10, pp : 1611- 1617(SCI 10 2008)[link]
  31. Pan CC;Yu CH;Lin KL,"The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn-3.0Ag-0.5Cu on a Cu substrate",APPLIED PHYSICS LETTERS; APPLIED PHYSICS LETTERSvol : 93, no : 06, pp : 1912- 1914(SCI 08 2008)[link]
  32. Chiu YT;Lin KL;Lai YS,"Orientation transformation of Pb grains in 5Sn-95Pb/63Sn-37Pb composite flip-chip solder joints during electromigration test",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 7, pp : 1877- 1881(SCI 07 2008)[link]
  33. Liu NS;Lin KL,"Evolution of interfacial morphology of Sn-8.5Zn-0.5Ag-0.1Al-xGa/Cu system during isothermal aging",JOURNAL OF ALLOYS AND COMPOUNDS; JOURNAL OF ALLOYS AND COMPOUNDSvol : 456, no : 1-2, pp : 466- 473(SCI 05 2008)[link]
  34. Huang YL;Lin KL;Liu DS,"The micro-impact fracture behavior of lead-free solder ball joints",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 4, pp : 1057- 1063(SCI 04 2008)[link]
  35. Kuo SM;Lin KL,"Polarity effect of electromigration on intermetallic compound formation in a Cu/Sn-9Zn/Cu sandwich",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 4, pp : 1087- 1094(SCI 04 2008)[link]
  36. Lin KL;Shih PC,"IMC formation on BGA package with Sn-Ag-Cu and Sn-Ag-Cu-Ni-Ge solder balls",JOURNAL OF ALLOYS AND COMPOUNDS; JOURNAL OF ALLOYS AND COMPOUNDSvol : 452, no : 2, pp : 291- 297(SCI 03 2008)[link]
  37. Lai RS;Lin KL;Salam B,"Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders",SOLDERING & SURFACE MOUNT TECHNOLOGY; SOLDERING & SURFACE MOUNT TECHNOLOGYvol : 20, no : 1, pp : 22- 26(SCI2008)[link]
  38. Mohanty US;Lin KL,"Electrochemical corrosion behaviour of Pb-free Sn-8.5Zn-0.05Al-XGa and Sn-3Ag-0.5Cu alloys in chloride containing aqueous solution",CORROSION SCIENCE; CORROSION SCIENCEvol : 50, no : 9, pp : 2437- 2443(SCI 09 2008)[link]
  39. Lin KL;Chen SY;Mohanty US,"Effect of current density and plating time on the morphology of copper electrodeposits on an AFM tip",JOURNAL OF THE ELECTROCHEMICAL SOCIETY; JOURNAL OF THE ELECTROCHEMICAL SOCIETYvol : 155, no : 4, pp : 251- 255(SCI2008)[link]
  40. Chiu TC;Lin KL,"Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 23, no : 1, pp : 264- 273(SCI 01 2008)[link]
  41. Shih, PC;Lin, KL,"Correlation between interfacial microstructure and shear behavior of Sn-Ag-Cu solder ball joined with Sn-Zn-Bi paste",Journal of Materials Science; Journal of Materials Sciencevol : 42, no : , pp : 2574- 2581(SCI 04 2007)[link]
  42. Kuo, SM;Lin, KL,"Microstructure evolution during electromigration between Sn-9Zn solder and Cu",J. Materials Research; J. Materials Researchvol : 22, no : , pp : 1240- 1249(SCI 05 2007)[link]
  43. Shih, PC;Lin, KL,"Electrical resistance of Sn-Ag-Cu ball grid array packages with Sn-Zn-Bi addition jointed at 240 degrees C",J. Materials Research; J. Materials Researchvol : 22, no : , pp : 113- 123(SCI 01 2007)[link]
  44. Hsuan, TC;Lin, KL,"Effects of aging treatment on mechanical properties and microstructure of Sn-8.5Zn-0.5Ag-0.01Al-0.1Ga Solder",Materials Science & Engineering A; Materials Science & Engineering Avol : 456, no : , pp : 202- 209(SCI 05 2007)[link]
  45. Kuo, SM;Lin, KL,"The hillock formation in a Cu/Sn-9Zn/Cu lamella upon current stressing",J. Electronic Materials; J. Electronic Materialsvol : 36, no : , pp : 1378- 1382(SCI 10 2007)[link]
  46. Shih, PC;Lin, KL,"Spallation of interfacial Ag-Au-Cu-Zn compounds in Sn-Ag-Cu/Sn-Zn-Bi joints during 210 degrees C reflow",Journal of Alloys and Compounds; Journal of Alloys and Compoundsvol : 439, no : , pp : 137- 142(SCI 07 2007)[link]
  47. Mohanty, US;Lin, KL,"The polarization characteristics of Pb-free Sn-8.5Zn-XAg-0.1A1-0.05Ga alloy in 3.5% NaCl solution",Corrosion Science; Corrosion Sciencevol : 49, no : , pp : 2815- 2831(SCI 07 2007)[link]
  48. Mohanty, US;Lin, KL,"Electrochemical corrosion study of Sn-XAg-0.5Cu alloys in 3.5% NaCl solution",J. Materials Research;J. Materials Researchvol : 22, no : , pp : 2573- 2581(SCI 09 2007)[link]
  49. Yeh, PY;Song, JM;Lin, KL,"Dissolution behavior of Cu and Ag substrates in molten solders",J. Electronic Materials; J. Electronic Materialsvol : 35, no : , pp : 978- 987(SCI 05 2006)[link]
  50. Huang, CW;Lin, KL,"Morphology of intermetallic compounds formed between lead-free Sn-Zn based solders and Cu substrates",Journal ofElectronic Materials; Journal ofElectronic Materialsvol : 35, no : , pp : 2135- 2141(SCI 12 2006)[link]
  51. Shih, PC;Lin, KL,"Interfacial microstructure and shear behavior of Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste",Journal of Alloys and Compounds; Journal of Alloys and Compoundsvol : 422, no : , pp : 153- 163(SCI 09 2006)[link]
  52. Mohanty, US;Lin, KL,"Potentiodynamic polarization measurement of Sn-8.5Zn-XAl-0.5Ga alloy in 3.5% NaCl solution",Journal of The Electrochemical Society; Journal of The Electrochemical Societyvol : 153, no : , pp : B319- B324(SCI2006)[link]
  53. Mohanty, US;Lin, KL,"Effect of Al on the electrochemical corrosion behaviour of Pb free Sn-8.5 Zn-0.5 Ag-XAl-0.5 Ga solder in 3.5% NaCl solution",Applied Surface Science; Applied Surface Sciencevol : 252, no : , pp : 5907- 5916(SCI 06 2006)[link]
  54. Chen, KI;Cheng, SC;Wu, S;Lin, KL,"Effects of small additions of Ag, Al, and Ga on the structure and properties of the Sn-9Zn eutectic alloy",Journal of Alloys and Compounds; Journal of Alloys and Compoundsvol : 416, no : , pp : 98- 105(SCI 06 2006)[link]
  55. Liu, NS;Lin, KL,"The effect of Ga content on the wetting reaction and interfacial morphology formed between Sn-8.55Zn-0.5Ag-0.1Al-xGa solders and Cu",Scripta Materialia; Scripta Materialiavol : 54, no : , pp : 219- 224(SCI 01 2006)[link]
  56. Mohanty, US;Lin, KL,"The effect of alloying element gallium on the polarization characteristics of Pb-free Sn-Zn-Ag-Al-XGa solders in NaCl solution",Corrosion Science; Corrosion Sciencevol : 48, no : , pp : 662- 678(SCI 03 2006)[link]
  57. Yu, CH;Lin, KL,"The atomic-scale studies of the behavior of the crystal dissolution in a molten metal",Chemical Physics Letters; Chemical Physics Lettersvol : 418, no : , pp : 433- 436(SCI 02 2006)[link]
  58. Liu, NS;Lin, KL,"Microstructure and mechanical properties of low Ga content Sn-8.55Zn-0.5Ag-0.1Al-xGa solders",Scripta Materialia; Scripta Materialiavol : 52, no : , pp : 369- 374(SCI 03 2005)[link]
  59. Cheng, SC;Lin, KL,"Microstructure and mechanical properties of Sn-8.55Zn-1Ag-XAl solder alloys",Materials Trans – JIM; Materials Trans – JIMvol : 46, no : , pp : 42- 47(SCI 01 2005)[link]
  60. Yu, CH;Lin, KL,"Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 1242- 1249(SCI 05 2005)[link]
  61. Hsu, JC;Lin, KL,"The effect of saccharin addition on the mechanical properties and fracture behavior of electroless Ni-Cu-P deposit on Al",Thin Solid Films; Thin Solid Filmsvol : 471, no : , pp : 186- 193(SCI 01 2005)[link]
  62. Yu, CH;Lin, KL,"Early dissolution behavior of copper in a molten Sn-Zn-Ag solder",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 666- 671(SCI 03 2005)[link]
  63. Mohanty, US;Lin, KL,"Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution",Material Science and Engineering A; Material Science and Engineering Avol : 406, no : , pp : 34- 42(SCI 10 2005)[link]
  64. Shih, PC;Lin, KL,"Interfacial bonding behavior with introduction of Sn-Zn-Bi paste to Sn-Ag-Cu ball grid array package during multiple reflows",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 219- 229(SCI 01 2005)[link]
  65. Liu, YH;Lin, KL,"Damages and microstructural variation of high-lead and eutectic SnPb composite flip chip solder bumps induced by electromigration",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 2184- 2193(SCI 08 2005)[link]
  66. Song, JM;Liu, PC;Shih, CL;Lin, KL,"Role of ag in the formation of interfacial intermetallic phases in Sn-Zn soldering",J. Electronic Materials; J. Electronic Materialsvol : 34, no : , pp : 1249- 1254(SCI 09 2005)[link]
  67. Shih, PC;Lin, KL,"Effect of microstructural evolution on electrical property of the Sn-Ag-Cu solder balls joined with Sn-Zn-Bi paste",J. Materials Research; J. Materials Researchvol : 20, no : , pp : 2854- 2865(SCI 10 2005)[link]
  68. Chuang, CM;Hung, HT;Liu, PC;Lin, KL,"The interfacial reaction between Sn-Zn-Ag-Ga-Al solders and metallized Cu substrates",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 33, no : , pp : 7- 13(SCI 01 2004)[link]
  69. Chuang, CM;Shih, PC;Lin, KL,"Mechanical strength of Sn-3.5Ag-based solders and related bondings",J. Electronic Materials; J. Electronic Materialsvol : 33, no : , pp : 1- 6(SCI 01 2004)[link]
  70. Liu, YH;Chuang, CM;Lin, KL,"Failure behavior upon shear test of 5Sn-95Pb solder bump after high temperature reliability test",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 19, no : , pp : 2471- 2477(SCI 08 2004)[link]
  71. Song, JM;Lin, KL,"Double peritectic behavior of Ag-Zn intermetallics in Sn-Zn-Ag solder alloys",JOURNAL OF MATERIALS RESEARCH; JOURNAL OF MATERIALS RESEARCHvol : 19, no : , pp : 2719- 2724(SCI 09 2004)[link]
  72. Huang, CW;Lin, KL,"Wetting properties of and interfacial reactions in lead-free Sn-Zn based solders on Cu and Cu plated with an electroless Ni-P/Au layer",MATERIALS TRANSACTIONS; MATERIALS TRANSACTIONSvol : 45, no : , pp : 588- 594(SCI 02 2004)[link]
  73. Song, JM;Liu, NS;Lin, KL,"Microstructures, thermal and tensile properties of Sn-Zn-Ga alloys",MATERIALS TRANSACTIONS; MATERIALS TRANSACTIONSvol : 45, no : , pp : 776- 782(SCI 03 2004)[link]
  74. Huang, CW;Lin, KL,"Interfacial reactions of lead-free Sn-Zn based solders on Cu and Cu plated electroless Ni-P/Au layer under aging at 150 degrees C",Journal of Materials Research; Journal of Materials Researchvol : 19, no : , pp : 3560- 3568(SCI 12 2004)[link]
  75. Lin, CT;Lin, KL,"Effects of current density and deposition time on electrical resistivity of electroplated Cu layers",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 15, no : , pp : 757- 762(SCI 11 2004)[link]
  76. Lin, KL;Wu, CH,"Structural evolution of electroless nickel bump",J. Electrochemical Society; J. Electrochemical Societyvol : 150, no : , pp : C273- C276(SCI 05 2003)[link]
  77. Lin, CT;Lin, KL,"Contact angle of 63Sn-37Pb and Pb-free solder on Cu plating",Applied Surface Science; Applied Surface Sciencevol : 214, no : , pp : 243- 258(SCI 05 2003)[link]
  78. Huang, CW;Lin, KL,"Microstructures and mechanical properties of Sn-8.55Zn-0.45A1-XAg solders",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 1528- 1534(SCI 07 2003)[link]
  79. Lin, KL;Liu, YH,"The cathode current efficiency of flip-chip solder bump plating",J. Electrochemical Society; J. Electrochemical Societyvol : 150, no : , pp : C529- C532(SCI 08 2003)[link]
  80. Cheng, SC;Lin, KL,"Interfacial evolution between Cu and Pb-free Sn-Zn-Ag-Al solders upon aging at 150 degrees C",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 1795- 1803(SCI 08 2003)[link]
  81. Hsu, JC;Lin, KL,"Enhancement in the deposition behavior and deposit properties of electroless Ni-Cu-P",J. Electrochemical Society; J. Electrochemical Societyvol : 150, no : , pp : C653- C656(SCI 09 2003)[link]
  82. Lin, KL;Shih, CL,"Wetting interaction between Sn-Zn-Ag solders and Cu",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 95- 100(SCI 02 2003)[link]
  83. Hsu, JC;Lin, KL,"Effect of internal stress on elemental diffusion and crystallization of electroless Ni-Cu-P deposit on Al",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 2221- 2227(SCI 09 2003)[link]
  84. Song, JM;Lin, KL,"Behavior of intermetallics in liquid Sn-Zn-Ag solder alloys",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 2060- 2067(SCI 09 2003)[link]
  85. Lin, KL;Sun, LM,"Electrodeposition of eutectic Sn-Zn alloy by pulse plating",J. Materials Research; J. Materials Researchvol : 18, no : , pp : 2203- 2207(SCI 09 2003)[link]
  86. Chuang, CM;Lin, KL,"Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1426- 1431(SCI 12 2003)[link]
  87. Lin, KL;Chen, KI;Shi, PC,"A potential drop-in replacement for eutectic Sn-Pb solder - The Sn-Zn-Ag-Al-Ga solder",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1490- 1495(SCI 12 2003)[link]
  88. Lin, CT;Lin, KL,"Preparation of Cu1-xTax films and the material interaction in the Si/Cu1-xTax/Cu structure",Materials Chemistry and Physics; Materials Chemistry and Physicsvol : 82, no : , pp : 306- 315(SCI 11 2003)[link]
  89. Chen, KI;Lin, KL,"The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - The effect of Ga",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1111- 1116(SCI 10 2003)[link]
  90. Lin, KL;Shih, CL,"Microstructure and thermal behavior of Sn-Zn-Ag solders",J. Electronic Materials; J. Electronic Materialsvol : 32, no : , pp : 1496- 1500(SCI 12 2003)[link]
  91. Cheng, SC;Lin, KL,"The thermal property of lead-free Sn-8.55Zn-1Ag-XAI solder alloys and their wetting interaction with Cu",J. Electronic Materials; J. Electronic Materialsvol : 31, no : , pp : 940- 945(SCI 09 2002)[link]
  92. Lin, KL;Hwang, JW,"Effect of crystallinity and thickness on the diffusion barrier behavior of electroless nickel deposit between Cu and solder",IEEE Trans. On Advanced Packaging; IEEE Trans. On Advanced Packagingvol : 25, no : , pp : 509- 513(SCI 11 2002)[link]
  93. Lin, KL;Hwang, JW,"Effect of thiourea and lead acetate on the deposition of electroless nickel",Materials Chemistry and Physics; Materials Chemistry and Physicsvol : 76, no : , pp : 204- 211(SCI 08 2002)[link]
  94. Chen, KI;Lin, KL,"The microstructures and mechanical properties of the Sn-Zn-Ag-Al-Ga solder alloys - the effect of Ag",J. Electronic Materials; J. Electronic Materialsvol : 31, no : , pp : 861- 867(SCI 08 2002)[link]
  95. Lin, KL;Hsiao, CC;Chen, KI,"Microstructural evolution of Sn-Ag-Cu-Al solder with respect to Al content and heat treatment",J. Materials Research; J. Materials Researchvol : 17, no : , pp : 2386- 2393(SCI 09 2002)[link]
  96. Lin, KL;Chang, YL;Huang, CC;Li, FI;Hsu, JC,"Microstructure evolution of electroless Ni-P and Ni-Cu-P deposits on Cu in the presence of additives",Applied Surface Science; Applied Surface Sciencevol : 181, no : , pp : 166- 172(SCI 09 2001)[link]
  97. Chen, CJ;Lin, KL,"Electroless Ni-Cu-P barrier between Si/Ti/Al pad and Sn-Pb flip-chip solder bumps",IEEE Trans. On Component and Packaging Technology; IEEE Trans. On Component and Packaging Technologyvol : 24, no : , pp : 691- 697(SCI 12 2001)[link]
  98. Lin, KL;Hsu, HM,"Sn-Zn-AlPb-free solder - An inherent barrier solder for Cu contact",J. Electronic Materials; J. Electronic Materialsvol : 30, no : , pp : 1068- 1072(SCI 09 2001)[link]
  99. Chen, CJ;Lin, KL,"The reactions between electroless Ni-Cu-P deposit and 63Sn-37Pb flip chip solder bumps during reflow",J. Electronic Materials; J. Electronic Materialsvol : 29, no : , pp : 1007- 1014(SCI 08 2000)[link]
  100. Lin, KL;Chen, CL,"Intermittent electroless nickel deposition in a fine trench flip chip bump pad",J. Electrochemical Society; J. Electrochemical Societyvol : 147, no : , pp : 2604- 2606(SCI 07 2000)[link]
  101. Chen, CJ;Lin, KL,"Internal stress and adhesion of amorphous Ni-Cu-P alloy on aluminum",Thin Solid Films; Thin Solid Filmsvol : 370, no : , pp : 106- 113(SCI 07 2000)[link]
  102. Lin, KL;Hsu, KT,"Electrodeposition behaviors of solder bumps from fluoroborate & sulfonate baths",Plating & Surface Finishing; Plating & Surface Finishingvol : 87, no : , pp : 86- 89(SCI 03 2000)[link]
  103. Lin, KL;Hsu, KT,"Manufacturing and materials properties of Ti/Cu/Electroless Ni/Solder bump on Si",IEEE Trans. Component and Packaging Technology; IEEE Trans. Component and Packaging Technologyvol : 23, no : , pp : 657- 660(SCI 12 2000)[link]
  104. Lin, KL;Yao, S,"Solder thickness variation with respect to soldering parameters",IEEE Trans. Component and Packaging Technology; IEEE Trans. Component and Packaging Technologyvol : 23, no : , pp : 661- 664(SCI 12 2000)[link]
  105. Lin, KL;Chen, JW,"Wave soldering bumping process incorporating electroless nickel UBM",IEEE Trans. Component and Packaging Technology; IEEE Trans. Component and Packaging Technologyvol : 23, no : , pp : 143- 150(SCI 03 2000)[link]
  106. Lin KL;Liu YC,"Reflow and property of Al/Cu/electroless nickel/Sn-Pb solder bumps",IEEE TRANSACTIONS ON ADVANCED PACKAGING; IEEE TRANSACTIONS ON ADVANCED PACKAGINGvol : 22, no : 4, pp : 568- 574(SCI 11 1999)[link]
  107. Lin KL;Liu YC,"Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps",IEEE TRANSACTIONS ON ADVANCED PACKAGING; IEEE TRANSACTIONS ON ADVANCED PACKAGINGvol : 22, no : 4, pp : 575- 579(SCI 11 1999)[link]
  108. Chen CJ;Lin KL,"The deposition and crystallization behaviors of electroless Ni-Cu-P deposits",JOURNAL OF THE ELECTROCHEMICAL SOCIETY; JOURNAL OF THE ELECTROCHEMICAL SOCIETYvol : 146, no : 1, pp : 137- 140(SCI 01 1999)[link]
  109. Lin KL;Liu YT,"Manufacturing of solder bumps with Cu/Ta/Cu as under bump metallurgy",IEEE TRANSACTIONS ON ADVANCED PACKAGING; IEEE TRANSACTIONS ON ADVANCED PACKAGINGvol : 22, no : 4, pp : 580- 585(SCI 11 1999)[link]
  110. Lin KL;Liu TP,"The electrochemical corrosion behaviour of Pb-free Al-Zn-Sn solders in NaCl solution",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 56, no : 2, pp : 171- 176(SCI 10 1998)[link]
  111. Lin KL;Liu TP,"High-temperature oxidation of a Sn-Zn-Al solder",OXIDATION OF METALS; OXIDATION OF METALSvol : 50, no : 3-4, pp : 255- 267(SCI 10 1998)[link]
  112. Lin KL;Chung FC;Liu TP,"The potentiodynamic polarization behavior of Pb-free XIn-9(5Al-Zn)-YSn solders",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 53, no : 1, pp : 55- 59(SCI 04 1998)[link]
  113. Lin KL;Wen LH;Liu TP,"The microstructures of the Sn-Zn-Al solder alloys",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 27, no : 3, pp : 97- 105(SCI 03 1998)[link]
  114. Lin KL;Chao WH,"Material interactions of solder bumps produced with fluxless wave soldering",IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING; IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGINGvol : 21, no : 1, pp : 59- 64(SCI 02 1998)[link]
  115. Lin KL;Wang YC,"Wetting interaction of Pb-free Sn-Zn-Al solders on metal plated substrate",JOURNAL OF ELECTRONIC MATERIALS; JOURNAL OF ELECTRONIC MATERIALSvol : 27, no : 11, pp : 1205- 1210(SCI 11 1998)[link]
  116. Lin KL;Wen LH,"The wetting of copper by Al Zn Sn solders",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 9, no : 1, pp : 5- 8(SCI 02 1998)[link]
  117. Lin KL;Chue CH;Kou BC,"Deformation and corrosion of hot dip galvanized coatings",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 50, no : 1, pp : 82- 87(SCI 08 1997)[link]
  118. Lee CY;Lin KL,"Preparation of solder bumps incorporating electroless nickel-boron deposit and investigation on the interfacial interaction behaviour and wetting kinetics",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 8, no : 6, pp : 377- 383(SCI 12 1997)[link]
  119. Lin KL;Chen SK;Chang SY,"Adhesion of multilayer solder pads on silicon",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 8, no : 4, pp : 253- 257(SCI 08 1997)[link]
  120. Chen CJ;Lin KL,"Wetting interactions between the Ni-Cu-P deposit and In-Sn solders",IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING; IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGINGvol : 20, no : 3, pp : 211- 216(SCI 08 1997)[link]
  121. Lin KL;Chao WH;Wu CD,"The performance and degradation behaviours of the TiAlN/interlayer coatings on drills",SURFACE & COATINGS TECHNOLOGY; SURFACE & COATINGS TECHNOLOGYvol : 89, no : 3, pp : 279- 284(SCI 03 1997)[link]
  122. Lin KL;Chen SK,"The interdiffusion and the feasibility of Al/Mo/Ni/(Pb-Sn) as a solder bump system",THIN SOLID FILMS; THIN SOLID FILMSvol : 295, no : 1-2, pp : 218- 223(SCI 02 1997)[link]
  123. Lin KL;Hwang MY;Wu CD,"The deposition and wear properties of cathodic arc plasma deposition TiAlN deposits",MATERIALS CHEMISTRY AND PHYSICS; MATERIALS CHEMISTRY AND PHYSICSvol : 46, no : 1, pp : 77- 83(SCI 10 1996)[link]
  124. Lin KL;Chang SY,"The morphologies and the chemical states of the multiple zincating deposits on Al pads of Si chips",THIN SOLID FILMS; THIN SOLID FILMSvol : 288, no : 1-2, pp : 36- 40(SCI 11 1996)[link]
  125. Lin KL;Chang SY,"Approaching a uniform bump height of the electroplated solder bumps on a silicon wafer",IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGING; IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART B-ADVANCED PACKAGINGvol : 19, no : 4, pp : 747- 751(SCI 11 1996)[link]
  126. Lin KL;Chang SY,"The morphologies and compositions of electroplated solder bumps on a silicon wafer",PLATING AND SURFACE FINISHING; PLATING AND SURFACE FINISHINGvol : 83, no : 6, pp : 58- 61(SCI 06 1996)[link]
  127. Lin KL;Chen CJ,"The interactions between In-Sn solders and an electroless Ni-P deposit upon heat treatment",JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS; JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICSvol : 7, no : 6, pp : 397- 401(SCI 12 1996)[link]
  128. HO JK;LIN KL,"PREPARATION OF AL-NI ALLOY-FILMS BY ALTERNATE SPUTTER-DEPOSITION",JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS; JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMSvol : 13, no : 4, pp : 2170- 2176(SCI 07 1995)[link]
  129. LIN KL;CHANG JT,"THE COMPOSITION AND MICROSTRUCTURE OF ELECTRODEPOSITED SOLDER ON ELECTROLESS NICKEL IN THE PRESENCE OF GELATIN",JOURNAL OF MATERIALS SCIENCE; JOURNAL OF MATERIALS SCIENCEvol : 30, no : 7, pp : 1879- 1883(SCI 04 1995)[link]
  130. LIN KL;LEE CY;HWANG MY,"WETTING OF METALS WITH CAST-IRON AND 304-STAINLESS-STEEL",JOURNAL OF MATERIALS SCIENCE LETTERS; JOURNAL OF MATERIALS SCIENCE LETTERSvol : 14, no : 18, pp : 1314- 1316(SCI 09 1995)

研討會論文

1. Ajayan Mano, Yue Zhang, Jian Liu, and Shih-kang Lin* (2023, Nov). In Situ XRD and Electrochemical Performance of Tellurium Infused Mesoporous Carbon CMK-3-Static an Anode for Lithium-Ion Batteries. 2023 Materials Research Society-Taiwan International Conference (2023 MRSTIC), Hsinchu, Taiwan.
2. Ajayan Mano, and Shih-Kang Lin* (2023, Oct). In Situ XRD and Electrochemical Performance of Gallium Infused Mesoporous Carbon CMK-3 as an Anode for Lithium-Ion Batteries. The 2023 International Conference on Green Electrochemical Technologies & The 2023 Annual Meeting of Electrochemical Society of Taiwan, Taiwan, Taipei.
3. Shubhayan Mukherjee, and Shih-kang Lin* (2023, Oct). Electric Current-Induced Unanticipated Phase Transition in Low-Temperature ƞ'-Cu6Sn5 Phase. NSRRC 29th Users Meeting and Workshop, Hsinchu, Taiwan.
4. Shubhayan Mukherjee, and Shih-kang Lin* (2023, Oct). Mechanical Properties of the η'-Cu6Sn5 upon Electrical Current stressing. IMPACT 2023 Conference, Taipei,Taiwan. 
5. 程品捷,林士剛,張凱鈞,謝克昌,蕭嘉賢(2023年10月)。高脈石含量燒結礦之燒結製程解析:模擬燒結實驗與熱力學計算。中國鑛冶工程學會112年年會,台中,台灣。
6. Shih-kang Lin*, Shao-yu Yen, and Hideyuki Murakami (2023, Jun). High-throughput CALPHAD-assisted design of the low-density Al-Co-Cr-Mo-Ti bcc/B2 refrac-tory high-entropy superalloy. 50th International Conference on Computer Coupling of Phase Diagrams and Thermochemistry (CALPHAD 2023), Cambridge, MA, USA 美國麻薩諸塞劍橋. 
7. Yu-ning Chiu, Shao-yu Yen, Chung-yi Yu, and Shih-kang Lin* (2023, Jun). High Temperature Al-Zn-Mg Alloys Design: High-throughput DFT Calculations and Machine Learning. 50th International Conference on Computer Coupling of Phase Diagrams and Thermochemistry (CALPHAD 2023), Cambridge, MA, USA 劍橋, 麻薩諸塞州, 美國. 
8. Shih-Kang Lin*, Chih-Han Yang, Yu-Chen Liu, Yuki Hirata, Hiroshi Nishikawa (2023, Apr). How to enhance Sn-Bi low-temperature solder by alloying?. 2023 International Conference on Electronics Packaging (ICEP), 日本九州熊本市. 
9. Yu-Chen Liu, Ahmad Kholik, and Shih-Kang Lin (2023, Apr). A machine learning approach to explore tensile properties of low-temperature solders. 2023 International Conference on Electronics Packaging (ICEP), 日本九州熊本市. 
10. Shubhayan Mukherjee, Yu-chen Liu, Shih-kang Lin (2023, Mar). Electric current effects upon ƞ & ƞ’ Cu6Sn5 intermetallic compound. 2023 TMS Annual Meeting & Exhibition, San Diego, CA, USA. 
11. Shao-Yu Yen, Hao-che Wang,Hideyuki Murakami,Shih-kang Lin (2023, Mar). Composition Design of Coherent Precipitate-strengthening Multiprincipal Element Alloys by High-throughput CALPHAD-type Calculation. 2023 TMS Annual Meeting & Exhibition, San Diego, CA, USA. 
12. Shao-Yu Yen, Hideyuki Murakami, Shih-kang Lin (2023, Mar). High-throughput CALPHAD-type Calculation in Design of Coherent Precipitate-strengthening Al-Co-Cr-Mo-Ti Refractory High Entropy Superalloys. 2023 TMS Annual Meeting & Exhibition, San Diego, CA, USA. 
13. Shih-kang Lin, Yu-chen Liu, Ciou-Ren Lee (2023, Mar). Electric current-induced lattice strain and grain orientation change in silver strip. 2023 TMS Annual Meeting & Exhibition, San Diego, CA, USA. 
14. Yu-chen Liu, Ahmad Kholik, Shih-kang Lin (2023, Mar). Machine Learning Models of Ultimate Tensile Strength and Elongation for Low-temperature Solder. 2023 TMS Annual Meeting & Exhibition, San Diego, CA, USA. 
15. Yu-ning Chiu, Chung-yi Yu, Shih-kang Lin (2023, Mar). Transition Mechanism for the Metastable Phases in Al-ZnMg Alloys: A Novel Molecular Dynamics Approach. 2023 TMS Annual Meeting & Exhibition, San Diego, CA, USA. 
16. Yu-ning Chiu, Shao-yu Yen, Chung-yi Yu, Shih-kang Lin, (2023, Mar). Ab initio exploration of alloying elements for stabilizing η’ nanoprecipitates in Al-Zn-Mg alloys. 2023 TMS Annual Meeting & Exhibition, San Diego, CA, USA. 
17. Jian-wei Huang, Tzu-hsuan Huang and Shih-kang Lin* (2023, Feb). The flux design for gallium oxide on the bonding process. 2023 11th Taiwan Phase Diagram Meeting2023第11屆臺灣相圖會議, Taipei, Taiwan 台北, 台灣. 
18. Shao-yu Yen, Murakami Hideyuki, and Shih-kang Lin (2023, Feb). High-throughput CALPHAD-assisted design of bcc/B2 Al-Co-Cr-Mo-Ti refractory high entropy superalloy. 2023 11th Taiwan Phase Diagram Meeting2023第11屆臺灣相圖會議, Taipei, Taiwan台北, 台灣. 
19. Shubhayan Mukherjee, Yu-chen Liu and Shih-kang Lin* (2023, Feb). Electrical Current Effects upon the Crystallographic Analysis of the Cu6Sn5 Intermetallic Compounds. 2023 11th Taiwan Phase Diagram Meeting2023第11屆臺灣相圖會議, Taipei, Taiwan 台北, 台灣. 
20. Yi-Jhen Kuo,Yu-Ning Chiu,Kai-Chun Chang,Ping-chieh Cheng and Shih-kang Lin* (2023, Feb). Behaviors of iron ores reduction by nitrogen, carbon dioxide and carbon monoxide mixture at 200℃-900℃. 2023 11th Taiwan Phase Diagram Meeting 2023第11屆臺灣相圖會議, Taipei, Taiwan 台北, 台灣. 
21. Yu-ning Chiu, and Shih-kang Lin* (2023, Feb). Development of high thermal stability aluminum alloys: a first-principles study. 2023 11th Taiwan Phase Diagram Meeting2023第11屆臺灣相圖會議, Taipei, Taiwan 台北, 台灣. 
22. Shih-kang Lin (2023, Jan). Interfacial stability of LLZO/LCO and LLTO/LNMO systems in oxides-based all-solid-state Li batteries. The 47th International Conference and Expo on Advanced Ceramics and Composites (ICACC2023), Daytona Beach, Florida, USA. 
23. Che-an Lin, Martin Ihrig, Kuan-chen Kung, Hsiang-ching Chen, Olivier Guillon, Shih-kang Lin (2022, Nov). Advanced co-sintering of a LiNi0.5Mn1.5O4 and Li0.33La0.55TiO3 composite cathode for all-solid-state Li batteries. International Bunsen Discussion Meeting Solid-state Batteries V, Frankfurt, Germany. 
24. Hsiang-ching Chen, Yu-chen Liu, Wan-yu Wang, Shih-kang Lin* (2022, Nov). Computation-assisted Design of Nitrate-based Phase Change Materials for Waste Heat Recovery. 2022 Materials Research Society-Taiwan Annual Conference, Maioli, Taiwan. 
25. Pin-Ching Huang,Tran Ngoc Thanh Thuy, Shih-Kang Lin* (2022, Nov). Study on Lithium-Sodium Alloy: Microstructure and Interfacial Reaction with LLZO. 2022 Materials Research Society-Taiwan Annual Conference, Maioli, Taiwan. 
26. Yu-ning Chiu Chung-yi Yu and Shih-kang Lin* (2022, Nov). Molecular dynamics investigation of transition mechanism for the metastable phases in Al-Zn-Mg alloys. 2022 Materials Research Society-Taiwan Annual Conference, Maioli, Taiwan. 
27. Ajayan Mano and Shih-kang Lin* (2022, Oct). Preparation of Gallium Encapsulated Mesoporous Carbon CMK-3 and CMK-8 for Lithium-Ion battery. 4th International Conference on Emerging Advanced Nanomaterials ICEAN 2022, Newcastle, Australia. 
28. Yu-ning Chiu, and Shih-kang Lin* (2022年10月)。高熱穩定性鋁合金設計與開發:第一原理計算。2022中國鑛冶工程學會年會,Taipei, Taiwan。
29. Hiroshi Nishikawa; Yuki Hirata; Chih–han Yang; Shih–kang Lin (2022, Sep). Effect of low Bi content on mechanical properties of Sn-Bi-Zn-In alloy and its joint with Cu. 2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC), Sibiu, Romania. 
30. Shao-yu Yen, Shih-kang Lin*, and Hideyuki Murakami (2022, Sep). Computational thermodynamics-assisted design of Al-Co-Cr-Mo-Ti refractory high entropy superalloy. 日本金屬學會2022年秋期第171回講演大會, Fukuoka, Japan 福岡, 日本. International Cooperative Graduate Program. 
31. Chih-han Yang, Yu-chen Liu, Yuki Hirata and Hiroshi Nishikawa and Shih-kang Lin* (2022, May). Mechanical properties of Sn-Bi-Ag low-temperature Pb-free solders. 2022 International Conference on Electronics Packaging (ICEP 2022), Hokkaido, Japan. 
32. Shih-kang Lin*, Yu-chen Liu, and Kuan-hsueh Lin (2022, May). The Blech effect revisited – an in-situ study. 2022 International Conference on Electronics Packaging (ICEP 2022), Hokkaido, Japan. 
33. Tzu-hsuan Huang, Yu-chen Liu, Cheng-en Cheng, Chien-wei Huang, Chih-han Yang, Chih-feng Lin, Cheng-chi Wang, and Shih-kang Lin* (2022, May). High thermal stability Cu-to-Cu joints fabricated by using Ga-based paste. 2022 International Conference on Electronics Packaging (ICEP 2022), Hokkaido, Japan. 
34. Yu-chen Liu, Chih-han Yang, and Shih-kang Lin* (2022, May). Sn-based solder design using machine learning approach. 2022 International Conference on Electronics Packaging (ICEP 2022), Hokkaido, Japan. 
35. Shih-kang Lin, Yu-chen Liu, Yu ching Chen and Yu-ning Chiu (2022, Feb). Electric Current-assisted Treatment for 7075 Aluminum Alloy to Withstand High-speed Impact. TMS2022, California, USA. 
36. Yu-chen Liu and Shih-kang Lin (2022, Feb). Electronic Material Properties Exploration Using Machine Learning: In Effective Charge, Hardness, and Dissipation Factor. TMS2022, California, USA. 
37. Yu-ning Chiu, Chung-yi Yu and Shih-kang Lin (2022, Feb). Ab Initio Interfacial Stability and Cu-segregation Effect upon and Precipitates in Al-Zn-Mg-Cu Alloys. TMS2022, California, USA. 
38. Yu-ning Chiu, Chung-yi Yu and Shih-kang Lin (2022, Feb). SPG-20: Effects of Cu on the Interfacial Stability of Nanoprecipitates in Al-Zn-Mg-Cu Alloys from First-principles Investigations. TMS2022, California, USA. 
39. Ahmad Kholik, Yu-Chen Liu*, Chih-han Yang, and Shih-Kang Lin (2022, Jan). Element doping effect on mechanical properties and microstructure of low-temperature Sn-Bi solder. The 2022 International Conference on Hierarchical Green Energy Materials (2022HIGEM). 
40. Che-an Lin and Shih-kang Lin (2022, Jan). Computation design of in situ formed protective layer in LiNi0.5Mn1.5O4/Li0.33La0.56TiO3/Li4Ti5O12 all-solid-state battery. 46th International Conference and Expo on Advanced Ceramics and Composites (ICACC2022), Florida, USA. 
41. Chih-han Yang, Yu-chen Liu, Yuki Hirata and Hiroshi Nishikawa and Shih-kang Lin* (2022, Jan). Nanoindentation of Bi phase in the Sn-Bi-Ag low-temperature lead-free solder. The 2022 International Conference on Hierarchical Green Energy Materials (2022HIGEM). 
42. Ciou-Ren Lee, Yu-Chen Liu, Shang-Jui Chiu and Shih-kang Lin* (2022, Jan). Current-induced residual stress and grain growth in silver strips. INTERNATIONAL CONFERENCE ON HIERARCHICAL GREEN ENERGY MATERIALS (2022HIGEM). 
43. Hao-che Wang, Shao-yu Yen, and *Shih-kang Lin (2022, Jan). A multi-principal element alloy with /′ microstructure designed by CALPHAD-type High-throughput Calculation. 2021 Taiwan Phase Diagram Conference (10th TAPHAD) 2021第10屆台灣相圖會議. 
44. Shao-yu Yen, Yu-chen Liu, Shun-hsiang Chu, Che-wei Chang, Shih-kang Lin*, and Ming-Hung Tsai (2022, Jan). Computational thermodynamics-assisted design of precipitate-strengthened Al-Co-Cr-Fe-Ni high entropy alloy. The 2022 International Conference on Hierarchical Green Energy Materials (2022HIGEM). 
45. Ting-yuan Gao and Shih-kang Lin* (2022, Jan). Calculational Thermodynamics Assisted Design of Ladle Slag System for Improving the Cleanliness of Al-Killed Steel. 2021 Taiwan Phase Diagram Conference (10th TAPHAD). 
46. Tzu-hsuan Huang , Yu-chen Liu , Cheng-en Cheng , Chien-wei Huang , Chih-han Yang , Chih-feng Lin , Cheng-chi Wang, and Shih-kang Lin* (2022, Jan). Highly reliable Cu-to-Cu interconnections by using Ga-based paste. 2021 Taiwan Phase Diagram Conference (10th TAPHAD). 
47. Tzu-hsuan Huang, Yu-chen Liu, Cheng-en Cheng, Chien-wei Huang, Chih-han Yang, Chih-feng Lin, Cheng-chi Wang, and Shih-kang Lin* (2022, Jan). High Reliability Cu/Cu TLP bonding by using Ga-based paste. The 2022 International Conference on Hierarchical Green Energy Materials (2022HIGEM). 
48. Yu-ning Chiu, Chung-yi Yu, and Shih-kang Lin (2022, Jan). First-principles insight into Cu-stabilized nanoprecipitates in Al-Zn-Mg-Cu alloys. The 2022 International Conference on Hierarchical Green Energy Materials (2022HIGEM). 
49. Yu-ning Chiu, and Shih-kang Lin* (2022, Jan). Interfacial characterization of Cu-stabilized nanoprecipitates in Al-Zn-Mg-Cu alloys: A first-principles study. 2021 Taiwan Phase Diagram Conference (10th TAPHAD). 
50. A. Mano, and S.-K. Lin.* (2021, Nov). Gallium Infused Composite Anode Material of Mesoporous Carbon CMK-8 for Lithium-Ion Batteries. 2021 Materials Research Society-Taiwan International Conference (2021 MRSTIC). 
51. C.-R. Lee, Y.-C. Liu, S.-K. Lin*, and S.-J. Chiu. (2021, Nov). Relaxation of electric current-induced residual stress in silver strips. 2021 Materials Research Society-Taiwan International Conference (2021 MRSTIC). 
52. Che-an Lin, Shih-kang Lin* (2021, Nov). Computation study on LiNi0.5Mn1.5O4/Li0.33La0.56TiO3 interface modification by doping in all-solid-state batteries. 2021 Materials Research Society-Taiwan International Conference (2021 MRSTIC). 
53. Hao-Che Wang, Shao-Yu Yen, and Shih-kang Lin* (2021, Nov). CALPHAD-assisted design of the Al-Cu-Fe-Ni-Ti multi-principal element alloys. 2021 Materials Research Society-Taiwan International Conference (2021 MRSTIC). 
54. J. -P. Chen, and S.-K. Lin.* (2021, Nov). The Study of solid electrolyte interphase for Li4Ti5O12 Anode Material. 2021 Materials Research Society-Taiwan International Conference (2021 MRSTIC). 
55. T.-Y. Gao, and S.-K. Lin.* (2021, Nov). Calculational Thermodynamics Assisted Design of Ladle Slag System for Improving the Cleanliness of Al-Killed Steel. 2021 Materials Research Society-Taiwan International Conference (2021 MRSTIC). 
56. W.-Y. Huang, and S.-K. Lin.* (2021, Nov). CALPHAD-assisted design of nitrate-based phase change materials for waste heat recycling. 2021 Materials Research Society-Taiwan International Conference (2021 MRSTIC). 
57. Yu-ning Chiu, Chung-yi Yu, and Shih-kang Lin* (2021, Nov). Stabilization of nanoprecipitates via Cu-segregation in Al-Zn-Mg-Cu alloys: A first-principles study. 2021 Materials Research Society-Taiwan International Conference (2021 MRSTIC). 
58. Chih-Han Yang, Yuki Hirata, Hiroshi Nishikawa and Shih-kang Lin (2021, Mar). High-throughput Calculations for Sn-Bi-Ag and Sn-Bi-Ag-In Low-temperature Lead-free Solders. The Minerals, Metals & Materials Society (TMS) 2021 Annual Meeting & Exhibition. 
59. Hiroshi Nishikawa, Shiqi Zhou,Chih-han Yang,Yu-An Shen and Shih-kang Lin (2021, Mar). Effect of Low Bi Content on Mechanical Property of Sn-Bi-Zn Alloy before and after Thermal Aging. The Minerals, Metals & Materials Society (TMS) 2021 Annual Meeting & Exhibition. 
60. Shih-Kang Lin (2021, Mar). Low-temperature Pb-free Solder Design. 2021 Taiwan-Japan Workshop on Advanced Passive Component Technology. 
61. Shih-kang Lin, Yu-chen Liu,Chih-han Yang, Yu-Hsiang Hsieh, Chien-wei Huang and Chih-feng Lin (2021, Mar). IMC-free Low-temperature TLP Cu-to-Cu Interconnection with Excellent Thermal Stability. The Minerals, Metals & Materials Society (TMS) 2021 Annual Meeting & Exhibition. 
62. Yu-Ching Chen, Kuan-hsueh Lin, Yu-Chen Liu, Tong Chen, Ting-Ju Chen, Woei-Shyan Lee and Shih-Kang Lin (2021, Mar). Electric Current Effect on the High-strain-rate Deformation of AA7075-T6 Al-alloy. The Minerals, Metals & Materials Society (TMS) 2021 Annual Meeting & Exhibition. 
63. Yu-chen Liu, Chih-han Yang, Hannah Carillo, Chuan-cheng Lin and Shih-kang Lin (2021, Mar). Using machine learning to predict hardness of Sn-based alloys. The Minerals, Metals & Materials Society (TMS) 2021 Annual Meeting & Exhibition. 
64. Ajayan Mano, Shih-Kang Lin* (2021, Jan). Gallium Infused Mesoporous Carbon as a Composite Anode Material for Lithium-Ion Batteries. 2021 International Conference on Hierarchical Green Energy Materials (2021HIGEM). 
65. Che-an Lin, Liang-jia Wang and Shih-kang Lin* (2021, Jan). Interfacial stability between the Li0.33La0.56TiO3 solid-state electrolyte and LiNi0.5Mn1.5O4 cathode and Li4Ti5O12 anode in all-solid-state batteries. 2021 International Conference on Hierarchical Green Energy Materials (2021HIGEM). 
66. Kaviarasan Govindarajan and Shih-Kang Lin* (2021, Jan). Influence of carbon coating on gassing behaviour of Li4Ti5O12 -based Lithium-ion batteries. 2021 International Conference on Hierarchical Green Energy Materials (2021HIGEM). 
67. Ngoc Thanh Thuy Tran, Che-An Lin and Shih-Kang Lin (2021, Jan). Ni-rich NMC cathode materials: phase equilibria and oxygen stability. 2021 International Conference on Hierarchical Green Energy Materials (2021HIGEM). 
68. Tzu-hsuan huang, yu-chen liu, chih-han yang, yu-hsiang hsieh, chien-wei huang, chih-feng lin, and shih-kang lin* (2021, Jan). An IMC-free bonding interface for Cu-to-Cu interconnections using Ga paste and Ni metallization layer. 2021 International Conference on Hierarchical Green Energy Materials (2021HIGEM). 
69. Yu-Chen Liu and Shih-Kang Lin* (2021, Jan). Machine Learning Method In Exploring Effective Charge And Hardness In Interconnection Materials. 2021 International Conference on Hierarchical Green Energy Materials (2021HIGEM). 
70. F.-Y. Wu, C.-H. Yang, and S. -K. Lin (2020, Nov). Phase equilibria of Al-Ni-Ga ternary system. 109年中國材料科學學會年會 (MRS-T 2020), 新北市, 台灣. 
71. W.-Y. Huang, and S. -K. Lin* (2020, Nov). CALPHAD-assisted process of multicomponent nitrates system for thermal energy storage. 109年中國材料科學學會年會 (MRS-T 2020), 新北市, 台灣. 
72. Y.-J. Lee and S. -K. Lin* (2020, Nov). Ab initio surface stability of Li4Ti5O12 defect spinel. 109年中國材料科學學會年會 (MRS-T 2020), 新北市, 台灣. 
73. Chih-han Yang, Yu-chen Liu, Yuki Hirata and Hiroshi Nishikawa and Shih-kang Lin* (2020, Oct). High-throughput calculations for Sn-Bi-based low-temperature lead-free solders. IMPACT-EMAP 2020. 
74. Yu-chen Liu, Chih-han Yang, Hannah Carillo, Chuan-cheng Lin and Shih-kang Lin* (2020, Oct). Predicting Sn-Based Solder Hardness Using Machine Learning. IMPACT-EMAP 2020. 
75. Yuki Hirata*, Chih-han Yang, Shih-kang Lin, Hiroshi Nishikawa (2020, Oct). Effects of minor element addition on mechanical properties of Sn-Bi alloy. IMPACT-EMAP 2020. 
76. C.-A. Lin, L.-J. Wang and S. -K. Lin* (2020, Aug). An ab initio study on interface reactions between Li0.33La0.56TiO3 solid-state electrolyte and electrodes in all-solid-state batteries. 2020 Taiwan PHAse Diagram Conference. 
77. C.-H. Yang, Y.-C. Liu, Y. Hirata, H. Nishikawa and S. -K. Lin* (2020, Aug). A Computational Thermodynamics-Assisted Design of Sn-Bi-Ag Alloy as Low-Temperature Lead-free Solders. 2020 Taiwan PHAse Diagram Conference. 
78. S.-Y. Yen, H.-C. Wang and S. -K. Lin* (2020, Aug). Composition design of coherent precipitate-strengthening AlCuFeNiTi multi-principal element alloys by high-throughput CALPHAD-type calculation. 2020 Taiwan PHAse Diagram Conference. 
79. Y.-J. Lee and S. -K. Lin* (2020, Aug). Ab initio Surface Stability of Li4Ti5O12 defect spinel. 2020 Taiwan PHAse Diagram Conference. 
80. Y.-N. Chiu, and S. -K. Lin* (2020, Aug). Ab initio study of Cu doping effect on the thermal stability of strengthening precipitates in 7075 aluminum alloy. 2020 Taiwan PHAse Diagram Conference. 
81. C.-A. Lin, R.-N. Nasara, and S. -K. Lin* (2020, Feb). An ab initio study on development of Co-free layered oxides as cathode materials in Li ion batteries. 149th TMS Annual Meeting & Exhibition (TMS 2020). 
82. H.-Y Wang, Y.-C. Liu, K.-J. Lin, and S. -K. Lin* (2020, Feb). CALPHAD-assisted analyses of BOF slag modification and reduction. 149th TMS Annual Meeting & Exhibition (TMS 2020). 
83. H.-Y. Wang, Y.-C. Liu, K.-J. Lin, and S. -K. Lin* (2020, Feb). CALPHAD-assisted analyses of BOF slag recovery. 149th TMS Annual Meeting & Exhibition (TMS 2020). 
84. K.-H. Chen, T. N. T. Thuy, and S. -K. Lin* (2020, Feb). Structural and Electrochemical Properties of Na3V2(PO4)2F3 as Cathode Material. 149th TMS Annual Meeting & Exhibition (TMS 2020). 
85. K.-H. Chen, T. N. T. Thuy, and S. -K. Lin* (2020, Feb). An ab initio study on the stable structure of sodium vanadium fluorophosphates as cathode materials in hybrid-ion batteries. 149th TMS Annual Meeting & Exhibition (TMS 2020). 
86. K.-H. Lin, Y.-C. Liu, C.-S. Ku, S.-J. Chiu and S.-K. Lin (2020, Feb). Revisit the Blech critical product: lattice strain induces electromigration effect. The minerals, metals and materials society 2020, San Diego, California, USA. 
87. K.-H. Lin, Y.-C. Liu, C.-S. Ku, S.-J. Chiu, and S. -K. Lin* (2020, Feb). From electric current-induced lattice strain to electromigration occurrence: an in situ study. 149th TMS Annual Meeting & Exhibition (TMS 2020). 
88. S.-Y. Yen, H.-C. Wang and S. -K. Lin* (2020, Feb). Composition design of coherent precipitate-strengthening AlCuFeNiTi multi-principal element alloys by high-throughput CALPHAD-type calculation. 149th TMS Annual Meeting & Exhibition (TMS 2020). 
89. S.-Y. Yen, H.-C. Wang and S. -K. Lin* (2020, Feb). High-throughput CALPHAD-type calculation in design of coherent precipitate-strengthening AlCuFeNiTi multi-principal element alloy. 149th TMS Annual Meeting & Exhibition (TMS 2020). 
90. S.-Y. Yen, S.-C. Wu, M. A. Makhraja, K.-C. Lo, A.-C. Yeh, K. Yoshimi, C. Zhang and S. -K. Lin* (2020, Feb). Experimental investigations and thermodynamic modelling of the Mo-Nb-Re ternary system. 149th TMS Annual Meeting & Exhibition (TMS 2020). 
91. Y.-C. Liu, Y.-S. Yu, S. -K. Lin*, and S.-J. Chiu (2020, Feb). Electromigration effect upon single-phase and two-phase Ag-Cu alloy: an in situ study. 149th TMS Annual Meeting & Exhibition (TMS 2020). 
92. SUKEMARE HIRATA, Chih-han YANG, Shih-kang Lin, HIROSHI NISHIKAWA (2020, Jan). Property Evaluation of Joint with Sn-Bi-Zn-In Low-Temperature Alloy. Symposium on Microjoining and Assembly Technology in Electronics(第26回「エレクトロニクスにおけるマイクロ接合・実装技術」シンポジウム), 日本 横浜. 
93. Y.-C. Liu (presenter), and S.-K. Lin* (2019, Nov). Exploring effective charge in electromigration using machine learning. 中國材料科學學會108年會, Tainan, Taiwan. 
94. Y.-C. Liu, Y.-S. Yu, S.-K. Lin* and F.-Y. Wu (presenter) (2019, Nov). Electromigration effect upon single- and two-phase Ag-Cu alloy strips: an in situ study. 中國材料科學學會108年會, Tainan, Taiwan. 
95. K.-H. Lin(presenter), Y.-C. Liu and S.-K. Lin(2019年11月)。The microstructure evolution on Aluminum thin film induced by voltage drop at fixed temperature: an in-situ XRD study。中國材料科學學會108年會,Tainan, Taiwan。 
96. 林哲安、藍三(Ralph N. Nasara)、林士剛(2019年11月)。以第一原理探討鋰離子電池中無鈷層狀正極材料之開發。中國材料科學學會108年會,Tainan, Taiwan。 
97. 王瀚宇、黃婉渝、劉永章、林冠儒、林士剛(2019年11月)。熱力學計算輔助轉爐石高溫熔融還原路徑設計。中國材料科學學會108年會,Tainan, Taiwan。 
98. 陳奎希、陳玉清水(Ngoc Thanh Thuy Tra)、林士剛(2019年11月)。第一原理探討Na3V2(PO4)2F3為正極之鈉鋰離子混合電池充放電機制。中國材料科學學會108年會,Tainan, Taiwan。 
99. 陳季昀、涂嘉豪、林士剛(2019年11月)。鉈掺雜石榴石型固態電解質與鋰金屬介面之研究。中國材料科學學會108年會,Tainan, Taiwan。 
100. 顏紹宇、汪皓哲、林士剛(2019年11月)。高通量熱力學計算設計共格析出強化AlCuFeNiTi多主元合金。中國材料科學學會108年會,Tainan, Taiwan。 
101. 黃婉渝、王瀚宇、林士剛(2019年11月)。溫泉場域廢熱應用之相轉變材料分析。中國材料科學學會108年會,Tainan, Taiwan。 
102. F.-Y. Wu, K.-H. Lin, Y.-C. Liu, and S. -K. Lin* (2019, Oct). Electromigration on Aluminum Thin Film:Lattice strain Induced Microstructure Evolution. 2019 Taiwan-Japan Workshop on Electronic Interconnection III. 
103. Ngoc Thanh Thuy Tran, and Shih-kang Lin (2019, Jul). Structural Optimization and Phase Stability of Cubic Li7La3Zr2O12 for Solid Electrolyte Application. The Electrochemical Conference on Energy and the Environment 2019, Glasgow, Scotland. MOST 105-2221-E-006-189-MY3. 
104. S.-K. Lin*(keynote speaker), S. Nagao, E. Yokoi, C. Oh, H. Zhang, Y.-C. Liu, S.-G. Lin and K. Suganuma (2019, Jul). Nano-volcanic eruption of silver: a computational thermodynamics study. the 2nd Materials Research Society of Thailand, Thailand, pattaya. 
105. S.-K. Lin*(presenter), P.-C. Tsai and R. N. Nasara (2019, Jun). Ab initio phase stability and electronic conductivity of the doped-Li4Ti5O12 anode for Li-ion batteries. 2019 International Conference on Computer Coupling of Phase Diagrams and Thermochemistry (CALPHAD XLVIII), Singapore. 
106. S.-Y. Yen(presenter), H.-C. Wang and S.-K. Lin (2019, Jun). High-throughput CALPHAD-type calculation in screening coherent precipitate-strengthening AlCuFeNiTi multi-principal element alloys. 2019 International Conference on Computer Coupling of Phase Diagrams and Thermochemistry (CALPHAD XLVIII), Singapore. 
107. C.-H. Yang (presenter), H.-M. Liao, C.-Y. Yeh and, S.-K. Lin (2019, Apr). A novel TLP bonding based on sub-micron Ga particles. International Conference on Electronics Packaging 2019 (ICEP 2020), Toki Messe, Niigata, Japan. MOST 104-2221-E-008-014-MY3. 
108. C.-H. Yang (presenter), S. Zhou, *S.-K. Lin and H. Nishikawa (2019, Apr). A computational Thermodynamic-Assisted Development of Sn-Bi-In-Ga Quaternary Alloys as Low-Temperature Pb-Free Solders. International Conference on Electronics Packaging 2019 (ICEP 2019), Toki Messe, Niigata, Japan. MOST 104-2221-E-008-014-MY3. 
109. Chih-han Yang, Shiqi Zhou, Shih-kang Lin, Hiroshi Nishikawa (2019, Apr). Development of Sn-Bi-In-Ga quaternary low-temperature solders. 2019 International Conference on Electronics Packaging (ICEP), Niigata, Japan. 
110. S.-K. Lin (presenter) (2019, Apr). Low-temperature Lead-free Solders: Phase Equilibria and Interfacial Reactions. International Conference on Electronics Packaging 2019 (ICEP 2021), Toki Messe, Niigata, Japan. MOST 104-2221-E-008-014-MY3. Invited talk. 
111. Shiqi Zhou, Chih-han Yang, Yu-An Shen, Shih-kang Lin, Hiroshi Nishikawa (2019, Apr). The study of Sn-45Bi-2.6Zn alloy before and after thermal aging. 2019 International Conference on Electronics Packaging (ICEP), Niigata, Japan. 
112. C.-H. Yang (presenter), Y.-C. Liu, Y.-K. Kuo, and S.-K. Lin (2019, Mar). Interfacial reactions in the Ga-doped Sn-0.7Cu/Cu couples and isothermal sections of the Sn-Cu-Ga ternary system. The Minerals, Metals & Materials Society 2020, San Antonio, Texas, USA. MOST 104-2221-E-008-014-MY3. 
113. C.-H. Yang, S. Zhou, H. Nishikawa, and S.-K. Lin (presenter) (2019, Mar). Development of Sn-Bi-In-Ga Quaternary Low-temperature Solder. The Minerals, Metals & Materials Society 2021, San Antonio, Texas, USA. 
114. Y.-C. Liu (presenter), S.-K. Lin and *D. Morgan (2019, Mar). Exploring effective charge in electromigration using machine learning. The Minerals, Metals & Materials Society 2019, San Antonio, Texas, USA. MOST 106-2628-E-006-002-MY3. 
115. C.-A. Lin (presenter), R.-N. Nasara and *S.-K. Lin (2018, Nov). An ab initio study on development of Co-free layered oxides as cathode materials in Li ion batteries. MRS-T 2018, Taichung, Taiwan. 
116. C.-A. Lin (presenter), R.-N. Nasara and *S.-K. Lin (2018, Nov). An ab initio study on development of Co-free layered oxides as cathode materials in Li ion batteries..MRS-T 2018, Taichung, Taiwan. MOST 105-2221-E-006-189-MY3. 
117. Y.-C. Liu, F.-Y. Wu, K.-H. Lin (presenter), and *S.-K. Lin (2018, Nov). Critical voltage induced electromigration in pure Al thin film: an in situ synchrotron radiation-based XRD work. MRS-T 2018, Taichung, Taiwan. MOST 106-2628-E-006-002-MY3. 
118. S.-Y. Yen(Presenter), S.-C. Wu, M. A. Makhraja, K.-C. Lo, A.-C. Yeh, K. Yoshimi, C. Zhang, and *S.-K. Lin(2018年10月)。超高溫相平衡實驗及建構鉬鈮錸三元系統熱力學模型。中國鑛冶學會107年年會,Taipei, Taiwan。科技部:106-2218-E-007-019.
119. Han-Yu Wang, Hung-Hua Yang, Yu-Lun Huang, Ku-Ling Chang, Guan-Ru Lin and *S.-K. Lin (2018, Jul). CALPHAD-assisted analyses on the modification of oxide and sulfide inclusions by calcium treatment. 6th cross-strait green materials & green processing forum, Shanghai, China. MOST 104-2622-8-006-001. 
120. *S.-K. Lin (presenter), R.-N. Nasara and P.-C. Tsai (2018, Jun). Ab initio study of electronic study of simple and transition metal-doped Li4Ti5O12. 19th International Meeting on Lithium Batteries (IMLB 2018), Kyoto, Japan. MOST 105-2221-E-006-189-MY3. 
121. C.-A. Lin (presenter), R.-N. Nasara and *S.-K. Lin (2018, Jun). An ab initio study on multi-principle-element layered oxides as cathode materials in Li ion batteries. 19th International Meeting on Lithium Batteries (IMLB 2018), Kyoto, Japan. MOST 105-2221-E-006-189-MY3. 
122. M.-L. Potestades (Presenter) and *S.-K. Lin (2018, Jun). Ab-initio study on cubic Li7La3Zr2O12 for all solid-state batteries. 19th International Meeting on Lithium Batteries (IMLB 2018), Kyoto, Japan. MOST 105-2221-E-006-189-MY3. 
123. R.-N. Nasara (presenter), *S.-K. Lin, and P.-C. Tsai (2018, Jun). An integrated investigation of the Rate-Liming Step in Li4Ti5O12 defect spinel anode materials for Lithium-Ion Batteries. 19th International Meeting on Lithium Batteries (IMLB 2018), Kyoto, Japan. MOST 105-2221-E-006-189-MY3. 
124. Y.-C. Liu (presenter) and *S.-K. Lin (2018, May). Electric current-induced intrinsic lattice strain: an in situ experiment and theoretical calculation. CALPHAD XLVII, Querétaro, México. MOST 106-2628-E-006-002-MY3. 
125. C.-H. Yang (presenter), S. Zhou, H. Nishikawa, and *S.-K. Lin (2018, Apr). Mechanical properties of Sn-Bi-In-Ga low melting temperature solder alloys. The second Japan-Taiwan Workshop on electronic interconnection, Kuwana, Mie, Japan. MOST 106-2628-E-006-002-MY3. 
126. C.-H. Yang (presenter), S. Zhou, H. Nishikawa, and *S.-K. Lin (2018, Apr). Development of Sn-Bi-In-Ga quaternary low-temperature solder. 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC2018), Kuwana, Mie, Japan. MOST 106-2628-E-006-002-MY3. 
127. H.-M. Liao (presenter), C.-Y. Yeh and *S.-K. Lin (2018, Apr). Ga-based Submicron Particle and Applications. The second Japan-Taiwan Workshop on electronic interconnection, Kuwana, Mie, Japan. MOST 106-2628-E-006-002-MY3. 
128. C.-H. Yang (presenter), Y.-C. Liu, Y.-K. Guo and *S.-K. Lin (2018, Mar). Ga-doping effect upon Sn-0.7Cu/Cu interfacial reactions and the isothermal section of Sn-Cu-Ga ternary system. The Minerals, Metals & Materials Society 147 th (TMS), Phoenix, Arizona, USA. MOST 106-2628-E-006-002-MY3. 
129. P.-W. Huang (presenter), R. N. Nasara, and *S.-K. Lin (2018, Mar). High-entropy oxides Li (Ni0.2Mn0.2Co0.2Zn0.2Cu0.2)O2 as cathode materials for lithium-ion batteries. The Minerals, Metals & Materials Society 147 th (TMS), Phoenix, Arizona, USA. MOST 105-2221-E-006-189-MY3. 
130. S.-Y. Yen (presenter), S.-C. Wu, M. A. Makhraja, K.-C. Lo, A.-C. Yeh, K. Yoshimi, C. Zhang and *S.-K. Lin (2018, Mar). Phase Equilibria and Thermodynamic Assessment of the Mo-Nb-Re Ternary System. The Minerals, Metals & Materials Society 147 th (TMS), Phoenix, Arizona, USA. MOST 106-2218-E-007-019. 
131. Y.-C. Liu (presenter), and *S.-K. Lin (2018, Mar). The electromigration effect revisited: an in situ SEM and SR-based XRD study. The Minerals, Metals & Materials Society 147 th (TMS), Phoenix, Arizona, USA. MOST 106-2628-E-006-002-MY3. 
132. Y.-C. Liu (presenter), and *S.-K. Lin (2018, Mar). Electric current-induced slip/twin transition: an in situ EBSD study. The Minerals, Metals & Materials Society 147 th (TMS), Phoenix, Arizona, USA. MOST 106-2628-E-006-002-MY3. 
133. H.-A. Dewanto (presenter), *S.-K. Lin, Y.-L. Huang and Y.-S. Su (2017, Nov). CALPHAD Assisted Analysis, Prediction, and Elimination of Carbide Segregation in High-carbon Chromium Steels. IUMRS-ICA 2017, Taipei, Taiwan. 
134. H.-M. Liao (presenter), C.-Y. Yeh, Y.-C Liu, M.-J. Wang and *S.-K. Lin (2017, Nov). Process optimization of Cu-to-Cu bonding using Ga-based sub-micron particles. IUMRS-ICA 2017, Taipei, Taiwan. 
135. H.-M. Liao (poster), C.-Y. Yeh, C.-H. Yang, and *S.-K. Lin (2017, Oct). A Novel Solid-solution Type TLP Bonding Using Sub-micron Ga-based Paste in Cu-to-Cu Interconnection. he Taiwan-Japan Workshop on Electronic Interconnections I, Taipei, Taiwan. 
136. Y.-C. Liu (presenter), and *S.-K. Lin (2017, Oct). In situ EBSD Studying on The Electric current-induced twining. he Taiwan-Japan Workshop on Electronic Interconnections I, Taipei, Taiwan. 
137. Y.-C. Liu (presenter), and *S.-K. Lin (2017, Oct). On The New Insight of Electromigration Effect: In Terms of Conventional Solid Mechanics’ Standpoint. The IMPACT 2017 Conference, Taipei, Taiwan. 
138. Y.-C. Liu (presenter), and *S.-K. Lin (2017, Oct). A Mechanism Study on The Electromigration Effect. 2017 Third Computational Mechanics Conference in Taiwan (3rd ACMT), Tainan, Taiwan. 
139. Y.-C. Liu, F.-Y. Wu (presenter), and *S.-K. Lin (2017, Oct). A Critical Voltage Drop For Electromigration Effect Occurrence. The IMPACT 2017 Conference, Taipei, Taiwan. 
140. Shih-kang Lin and Yu-chen Liu (2017, Jun). Alloy phase stability under electric currents. 2017 CALPHAD XLVI, Saint Malo, France. 
141. Shih-kang Lin, Yu-chen Lin, Shang-Jui Chiu, Yen-Ting Liu, and Hsin-Yi Lee (2017, Apr). Revisit the electromigration effect: in situ synchrotron X-ray and scanning electron microscopy and ab initio calculations. 2017 International Conference on Electronic Packaging (ICEP), Tendo, Yamagata, Japan. 
142. C.-Y. Yeh, Y.-K. Kuo, and S.-K. Lin (2017, Feb). Ductile and strong Cu-to-Cu interconnection using Ga-based pastes for applications on 3D IC and WBG devices. 146th TMS Annual Meeting & Exhibition (TMS 2017), San Diego, California, USA. 
143. R. -N. Nasara, S.-K. Lin, and P.-C. Tsai (2017, Feb). Defect engineering of Li4Ti5O12 anode with enhanced electrochemical properties for Li ion batteries by thermal reduction. 146th TMS Annual Meeting & Exhibition (TMS 2017), San Diego, California, USA. 
144. S.-K. Lin (2017, Feb). Ab initio study on the charging/discharging behaviors of lithium-rich layered composite cathode material in lithium-ion batteries. Taiwan-Germany Joint Workshop on Advanced Secondary Battery Technologies, Tainan, Taiwan. 
145. S.-K. Lin, C.-Y. Yeh, M.-J. Wang, and H.-M. Chang (2017, Feb). Ultra thermal stable Cu-to-Cu interconnection. 146th TMS Annual Meeting & Exhibition (TMS 2017), San Diego, California, USA. 
146. Y.-C. Liu and S.-K. Lin (2017, Feb). Ab initio critical product of Blech distance and current density. 146th TMS Annual Meeting & Exhibition (TMS 2017), San Diego, California, USA. 
147. Y.-N. Pei, R. -N. Nasara, and S.-K. Lin(2016年12月)。Highly defective Li4Ti5O12 anode material with enhanced rate capability for Li ion batteries utilizing thermal reduction。中國機械工程學會【105年度年會】暨【第33屆全國學術研討會】暨【科技部機械固力、熱流、能源學門聯合成果發表會】,新竹,台灣。
148. S.-K. Lin, Y.-C. Chuang, and P.-C. Tsai (2016, Nov). Ab initio Mechanistic Study on the Changing Behavior of Lithium-rich Layered Composite Cathode Material in Lithium-ion Batteries. 2016 The Materials Research Society (MRS) fall meeting, Boston, U.S.A. 
149. S.-K. Lin, Y.-C. Liu, S.-J. Chiu, Y.-T. Liu, and H.-Y. Lee (2016, Nov). On the Electromigration and Lattice Stability under Electric Current Stressing. 2016 The Materials Research Society (MRS) fall meeting, Boston, U.S.A. 
150. C.-C. Liang and S.-K. Lin(2016年11月)。鋰電池中元素摻雜LiNi1/3Mn1/3Co1/3O2陰極材料之第一原理計算研究。2016 The Materials Research Society of Taiwan (MRS-T),新竹,台灣。
151. S.-K. Lin, Y.-C. Chuang, and P.-C. Tsai(2016年11月)。An ab initio mechanistic investigation on the charging/discharging behaviors of xLi2MnO3•(1-x)LiM’O2 composite-layered cathode material for lithium-ion batteries。2016 The Materials Research Society of Taiwan (MRS-T),新竹,台灣。本人為第一作者、通訊作者。 
152. S.-Y. Lee, Y.-H. Su, and S.-K. Lin(2016年11月)。熱力學計算輔助高錳高鋁鋼連鑄鑄粉開發。2016 The Materials Research Society of Taiwan (MRS-T),新竹,台灣。
153. Y.-C. Liu, Y.-S. Yu, and S.-K. Lin(2016年11月)。Electric currents-induced microstructure evolution of the Ag-25at.%Cu alloys。2016 The Materials Research Society of Taiwan (MRS-T),新竹,台灣。
154. 林士剛, 莊祐誠, 蔡秉均(2016年10月)。層狀過鋰複合正極材料之原子級解析。2016年先進鋰離子電池研討會,台南,台灣。本人為第一作者、通訊作者。 
155. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, Y.-T. Liu, H.-Y. Lee, and S.-K. Lin (2016, Oct). On the origin of electric current induced stress: An in situ synchrotron radiation and ab initio study. The IMPACT 2016 conference, 台北,台灣. 
156. Y.-C. Liu and S.-K. Lin(2016年09月)。Electric currents-induced mechanical behaviors of materials。2016 Taiwan Phase Diagrams Meeting (TAPHAD),Taichung, Taiwan.
157. C.-M. Wu, C.-C. Chang, P.-I. Pan, M. Avdeev, C.-P. Liu, Y.-W. Cheng, S.-K. Lin, and P.-C. Tsai (2016, Sep). Understanding the inserted sodium in spherical carbon and hard carbon electrode of sodium ion battery. 2016 綠色電化學科技學術研討會暨2016年台灣電化學學會年會, Taipei, Taiwan. 
158. R. N. Nasara and S.-K. Lin (2016, Sep). Highly defective lithium titanate oxide anode with enhanced rate performance for lithium-ion batteries. 2016 Taiwan Phase Diagrams Meeting (TAPHAD), Taichung, Taiwan. 
159. Y.-C. Chuang, P.-W. Huang, P.-C. Tsai, and S.-K. Lin (2016, Sep). An ab initio mechanistic study on the charging/discharging behaviors of lithium-rich layered oxide as cathodes in lithiumion batteries. 2016 綠色電化學科技學術研討會暨2016年台灣電化學學會年會, Taipei, Taiwan. 
160. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, Y.-T. Liu, H.-Y. Lee, J.-J. Lee, C.-C. Kao, and S.-K. Lin (2016, Sep). On the Origin of Electric Current Induced Phase Equilibria Change. The 22nd NSRRC Users' Meeting & Workshops, Hsinchu, Taiwan. 
161. S.-K. Lin (2016, Jun). CALPHAD-assistedmaterials design for new steel and new materials in steelmaking. 2016 MOST-NIMS Workshop for Innovative Materials for Safe and Sustainable Society, Tainan, Taiwan.
162. S.-G. Lin, Y.-H. Su, K.-L. Chang, and *S.-K. Lin (2016, May). CALPHAD-assisted morphology control of manganese sulfide inclusions in free-cutting steels. CALPHAD XLV The forty-fifth International Conference on CALPHAD (2016 CALPHAD XLV), Awaji Island, Hyogo, Japan. MOST 103-2221-E-006-043-MY3. 
163. S.-K. Lin, S. Nagao, E. Yokoi, C. Oh, H. Zhang, Y.-C. Liu, S.-G. Lin, and K. Suganuma (2016, May). Silver nano-volcanic eruption: A CALPHAD un-puzzling. CALPHAD XLV The forty-fifth International Conference on CALPHAD (2016 CALPHAD XLV), Awaji Island, Hyogo, Japan. MOST 103-2221-E-006-043-MY3. 
164. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, Y.-T. Liu, H.-Y. Lee, and S.-K. Lin (2016, May). On the lattice stability of copper under current stressing. CALPHAD XLV The forty-fifth International Conference on CALPHAD (2016 CALPHAD XLV), Awaji Island, Hyogo, Japan. MOST 103-2221-E-006-043-MY3. 
165. C.-Y Yeh, Y.-K. Kuo, and S.-K. Lin (2016, Apr). A novel approach for forming ductile Cu-to-Cu interconnection. 2016 International Conference on Electronics Packaging (ICEP2016), Sapporo, Japan. MOST 103-2221-E-006-043-MY3. 
166. S.-K. Lin, C.-Y Yeh, M.-J. Wang, H.-M. Chang (2016, Apr). Ultra thermal stable Cu-to-Cu interconnection. 2016 International Conference on Electronics Packaging (ICEP2016), Sapporo, Japan. MOST 103-2221-E-006-043-MY3. 
167. H. Zhang, S. Nagao, S.-K. Lin, E. Yokoi, C. Chen, and K. Suganuma (2016, Mar). A novel mechanism of silver microflakes sinter joining. China Semiconductor Technology International Conference (CSTIC) 2016, Shanghai, China. 
168. K. Suganuma, S. Nagao, T. Sugahara, E. Yokoi, H. Zhang, J. Jiu, and S.-K. Lin (2016, Mar). Silver Sinter Joining for WBG Die-attach. 2016 MRS Spring Meeting & Exhibit in Phoenix (2016 MRS), Phoenix, Arizona, USA. MOST 103-2221-E-006-043-MY3. 
169. R.-N. Nasara, P.-C. Tsai, S.-K. Lin, and K.-Z. Fung (2016, Mar). Novel synthesis of defect Li4Ti5O12 spinel with enhanced high-rate capability utilizing an ethanol thermal reduction process. 2016 MRS Spring Meeting & Exhibit in Phoenix (2016 MRS), Phoenix, Arizona, USA. MOST 103-2221-E-006-043-MY3. 
170. C.-S. Huang, S.-K. Lin, and C.-L. Huang (2016, Feb). An Eco-friendly Red Phosphor with Very High Intensity. 145th TMS Annual Meeting & Exhibition (TMS 2016), Nashville, Tennessee, USA. MOST 103-2221-E-006-043-MY3. 
171. C.-S. Huang, Y.-D. Ho, C.-L. Huang, and S.-K. Lin (2016, Feb). An Experimental and Computational Approach to Properties of Mg2TiO4: Mn+4 Red Emitting Phosphor. 145th TMS Annual Meeting & Exhibition (TMS 2016), Nashville, Tennessee, USA. MOST 103-2221-E-006-043-MY3. 
172. S. Nagao, C. Oh, S.-K. Lin, H. Zhang, E. Yokoi, T. Ishibashi, and K. Suganuma (2016, Feb). Low-temperature pressure-less silver-to-silver direct bonding at ambient condition: Part I-Experimental study. 145th TMS Annual Meeting & Exhibition (TMS 2016), Nashville, Tennessee, USA. MOST 103-2221-E-006-043-MY3. 
173. S.-K. Lin, S. Nagao, C. Oh, H. Zhang, Y.-C. Liu, S.-G. Lin, and K. Suganuma (2016, Feb). Low-temperature pressure-less silver-to-silver direct bonding at ambient condition: Part II-Mechanistic study. 145th TMS Annual Meeting & Exhibition (TMS 2016), Nashville, Tennessee, USA. MOST 103-2221-E-006-043-MY3. 
174. Y.-C. Chuang, P.-C. Tsai, S.-K. Lin (2016, Feb). Ab Initio Mechanistic Study on the Charging/Discharging Behaviors of the Layered-layered Lithium-rich Composite Cathode for Lithium-ion Batteries. 145th TMS Annual Meeting & Exhibition (TMS 2016), Nashville, Tennessee, USA. MOST 103-2221-E-006-043-MY3. 
175. Y.-C. Chuang, P.-C. Tsai, and S.-K. Lin (2016, Feb). Why Does Li-rich Layered Oxide Cathode Material Degrade in Lithium Ion Batteries? 145th TMS Annual Meeting & Exhibition (TMS 2016), Nashville, Tennessee, USA. MOST 103-2221-E-006-043-MY3. 
176. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, Y.-T. Liu, H.-Y. Lee, and S.-K. Lin (2016, Feb). A New Insight on the Electromigration Effect: Strain-induced Atomic Migration under Current Stressing. 145th TMS Annual Meeting & Exhibition (TMS 2016), Nashville, Tennessee, USA. MOST 103-2221-E-006-043-MY3. 
177. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, Y.-T. Liu, H.-Y. Lee, and S.-K. Lin (2016, Feb). Why does electromigration occur? – A combinatorial study using ab initio calculations and synchrotron radiation diffractometry. 145th TMS Annual Meeting & Exhibition (TMS 2016), Nashville, Tennessee, USA. MOST 103-2221-E-006-043-MY3. 
178. R.-N. Nasara, K.-W. Lu, Y.-T. Pan, P.-C. Tsai, W.-C. Lin, C.-T. Ni, S.-K. Lin, K.-Z. Fung (2015, Nov). Defect engineering and electrochemical performance of Li4Ti5O12 defect spinel anode material utilizing a modified RAPET approach. 62ndTaiwan Institute of Chemical Engineers Annual Meeting (TwIChE 2015), Kaohsiung, Taiwan. 
179. R.-N. Nasara, K.-W. Lu, Y.-T. Pan, P.-C. Tsai, W.-C. Lin, C.-T. Ni, S.-K. Lin, K.-Z. Fung (2015, Nov). Defect Engineering and electrochemical performance of Li4Ti5O12 Defect spinel anode material utilizing a modified RAPET approach. 5th international symposium on advance ceramics and Technology for Sustainable Energy Applications Toward a Low Carbon Society (2015 ACTSEA), Tainan, Taiwan. 
180. S.-K. Lin, Y.-C. Liu, C.-K. Yeh, Y.-S. Yu (2015, Nov). Alloy Phase Stability and Phase Equilibria under Electric Current Stressing. 2015 The Materials Research Society of Taiwan (2015 MRS-T), Kaohsiung, Taiwan. 
181. Y.-C. Chuang, P.-C. Tsai, S.-K. Lin (2015, Nov). Ab initio mechanistic study on the first charging behavior of the lithium-rich composite cathode material for lithium-ion batteries. 62ndTaiwan Institute of Chemical Engineers Annual Meeting (TwIChE 2015), Kaohsiung, Taiwan. 
182. Y.-C. Chuang, P.-C. Tsai, S.-K. Lin (2015, Nov). Theoretical mechanistic investigation on the first charging behaviors of xLi2MnO3•(1-x) LiM’O2 composite-layered cathode for lithium-ion batteries. 5th international symposium on advance ceramics and Technology for Sustainable Energy Applications Toward a Low Carbon Society (2015 ACTSEA), Tainan, Taiwan. 
183. Y.-C. Liu, S.-J. Chiu, C.-C. Kao, J.-J. Lee, S.-K. Lin (2015, Nov). Critical voltage-drop induced atomic diffusion in Al stripes - An in situ synchrotron X-ray diffractometry study. 62ndTaiwan Institute of Chemical Engineers Annual Meeting (TwIChE 2015). 
184. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, Y.-T. Liu, H.-Y. Lee, S.-K. Lin (2015, Nov). Electric current-induced strain gradients and atomic migration:An in situ synchrotron radiation and ab initio study. 2015 The Materials Research Society of Taiwan (2015 MRS-T), Kaohsiung, Taiwan. 
185. C.-S. Huang, Y.-D. Ho, C.-L. Huang, S.-K. Lin (2015, Oct). Non-Rare Earth Mg2TiO4: Mn+4 Red Emitting Phosphor: A combined Experimental and Ab Initio Study. The IMPACT 2015 conference, Taipei, Taiwan. 
186. H.-M. Liao, C.-Y. Yeh, T.-C. Wang, Stuwart Fan, Futton Chu, Louie Huang, S.-K. Lin (2015, Oct). Effects of Ni, Co, Bi-co-doping upon Sn-Ag-Cu solder/Cu joints. The IMPACT 2015 conference, Taipei, Taiwan. 
187. R.-N. Nasara, K.-W. Lu, Y.-T. Pan, P.-C. Tsai, W.-C. Lin, C.-T. Ni, S.-K. Lin, K.-Z. Fung (2015, Oct). A modified RAPET approach to Li4Ti5O12 defect spinel nanoparticles as anode material for lithium ion batteries. The 66th International Society of Electrochemistry Annual Meeting, Taipei, Taiwan. 
188. S.-K. Lin, P.-C. Tsai, W.-D. Hsu (2015, Oct). Ab initio-aided Li4Ti5O12 defect spinel electrode materials designs for durable lithium ion batteries. The 66th International Society of Electrochemistry Annual Meeting, Taipei, Taiwan. 
189. Y.-C. Chuang, P.-C. Tsai, S.-K. Lin (2015, Oct). Ab initio lattice stability of the xLi2MnO3•(1-x)Li(Ni1/3Mn1/3Co1/3)O2 composite-layered cathode materials for lithium-ion batteries. The 66th International Society of Electrochemistry Annual Meeting, Taipei, Taiwan. 
190. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, Y.-T. Liu, H.-Y. Lee, S.-K. Lin (2015, Oct). On the mechanism of electromigration effect: An in-situ synchrotron radiation and ab initio study. The IMPACT 2015 conference, Taipei, Taiwan. 
191. 林士桂, 林士剛, 蘇彥豪(2015年10月)。快削鋼中硫化錳介在物之形貌控制技術開發。中國礦冶工程學會年會。 
192. K. Suganuma, S. Nagao, T. Sugahara, J. Jiu, E. Yokoi, H. Zhang, S.-K. Lin (2015, Sep). Nanoparticle or Microparicle sintering for 3D/Power Assembly? The 10th IEEE Nanotechnology Materials and Devices Conference (NMDC 2015), Anchorage Alaska, USA. 
193. S.-K. Lin, G.-L. Ou, Y.-H. Su, M.-J. Lu (2015, Sep). Interfacial reactions between high-Mn high-Al steels and continuous casting mold fluxes. The 4th Cross-strait Green Materials & Green Processing Forum. 
194. Y.-C. Liu, S.-J. Chiu, C.-C. Kao, J.-J. Lee, S.-K. Lin (2015, Sep). Why is electromigration not observed below the “Blech distance”?- An in situ synchrotron radiation study. The 21st NSRRC Users' Meeting & Workshops, Hsinchu, Taiwan. 
195. Y.-C. Liu, Y.-S. Yu, S.-J. Chiu, Y.-T. Liu, H.-Y. Lee, S.-K. Lin (2015, Sep). Electric current-induced strain gradients and atomic migration: An in situ synchrotron radiation and ab initio study. The 21st NSRRC Users' Meeting & Workshops, Hsinchu, Taiwan. 
196. M. A. Makhraja and Shih-kang Lin (2015, Jun). Ab initio-aided thermodynamic reassessment of the Mo-Zr binary system. The 8th Conference of Asian Consortium on Computational Materials Science (ACCMS-8), Taipei, Taiwan. 
197. Mei-jun Wang, Hao-miao Chang, and Shih-kang Lin (2015, Mar). A novel Ga-based Cu-to-Cu bonding approach for 3D IC packaging. 144th TMS Annual Meeting & Exhibition (TMS 2015), Orlando, Florida, USA. 
198. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu (2015, Mar). Ab initio physical and electrochemical properties of Kröhnkite-type Na2Fe(SO4)2∙2H2O sulfate as cathode for Na ion batteries. 144th TMS Annual Meeting & Exhibition (TMS 2015), Orlando, Florida, USA. 
199. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu (2015, Mar). An ab initio-aided experimental investigation on W-doped Li4Ti5O12 defect spinel as anodes for Li ion batteries. 144th TMS Annual Meeting & Exhibition (TMS 2015), Orlando, Florida, USA. 
200. Shu-chang Wu, Ki-Ling Cheng, Chuan Zhang, and Shih-kang Lin (2015, Mar). Re-assessment of the Mo-Nb, Mo-Re, and Nb-Re binary systems. 144th TMS Annual Meeting & Exhibition (TMS 2015), Orlando, Florida, USA. 
201. Yi-kai Kuo, Trong Lan Nguyen, and Shih-kang Lin (2015, Mar). Interfacial reactions in Sn-0.7Cu-xGa/Cu joints and phase equilibria of the Cu-Ga-Sn ternary system at 200 °C. 144th TMS Annual Meeting & Exhibition (TMS 2015), Orlando, Florida, USA. 
202. Yu-chen Liu and Shih-kang Lin (2015, Mar). Phase stability of Sn-Pb, Sn-Cu and Sn-Ag binary systems under current stressing. 144th TMS Annual Meeting & Exhibition (TMS 2015), Orlando, Florida, USA. 
203. Hao-miao Chang, Mei-jun Wang, Cheng-liang Cho, and Shih-kang Lin (2014, Oct). A novel Ga-based Cu-to-Cu Bonding Technology in 3D IC Interconnections. International Microsystems, Packaging, Assembly, Circuits Technology Conference, Taipei, Taiwan. 
204. Ping-chun Tsai, Wen-Dung Hsu, and Shih-kang Lin (Invited) (2014, Oct). Ab initio-aided defect spinel electrode design for durable lithium ion batteries. International Union of Materials Research Societies - International Conference of Young Researchers on Advanced Materials (IUMRS-ICYRAM), Haihou, China. 
205. Guan-ling Ou, Yen-hao Su, Shih-kang Lin, and Mo-rong Lu(2014年11月)。高合金鋼連鑄鑄粉開發。台灣鑄造學會年會,Kaohsiung, Taiwan。
206. Shu-chang Wu, Yen-hao Su, Shih-guei Lin, and Shih-kang Lin(2014年11月)。Fe-Al-Mn-Si-C五元系統之熱力學模型建構及應用。台灣鑄造學會年會,Kaohsiung, Taiwan。
207. Shu-chang Wu, Yen-hao Su, Shih-guei Lin, Shih-kang Lin(2014年10月)。高合金鋼連續鑄造之高溫熱機械性質量測與CALPHAD熱力學解析。中國礦冶工程學會年會,Taipei, Taiwan。 
208. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu (2014, Aug). Optimized Li4Me5O12 defect spinel electrode materials for lithium ion batteries using ab initio calculations. International Union of Materials Research Societies - International Conference in Asia (IUMRS-ICA 2014), Fukuoka, Japan. 
209. Ping-chun Tsai, Shih-kang Lin, and Weng-Dung Hsu (2014, Aug). Ab Initio study on nature's missing Li4Me5O12 defect spinel oxides. International Union of Materials Research Societies - International Conference in Asia 2014 (IUMRS-ICA 2014), Fukuoka, Japan. 
210. Shih-kang Lin (Keynote) (2014, Aug). Electric current effects upon electronic solder joints. International Union of Materials Research Societies - International Conference in Asia (IUMRS-ICA 2014), Fukuoka, Japan. 
211. Hao-miao Chang, Cheng-liang Cho, and Shih-kang Lin (2014, Jun). A novel Ga-based Cu-to-Cu TSV interconnection with Pt UBM. International Union of Materials Research Societies - International Conference on Electronic Materials 2014 (IUMRS-ICEM 2014), Taipei, Taiwan. 
212. Ping-chun Tsai, Weng-Dung Hsu, and Shih-kang Lin (2014, Jun). Ab initio-aided defect spinel electrode design for lithium ion batteries with high cyclability. CALPHAD XLIII 2014, Changsha, Hunan, P. R. China. 
213. Shu-chang Wu, Chi-ling Cheng, Chuan Zhang, and Shih-kang Lin (2014, Jun). Ab initio-aided CALPHAD modeling for the Mo-Nb-Re ternary system. CALPHAD XLIII 2014, Changsha, Hunan, P. R. China. 
214. Weng-Dung Hsu, Che-wei Hsu, Tsung-chun Wu, Zary Adabavazeh, Tsang-Tse Fang, and Shih-kang Lin (2014, Jun). Nonstoichiometry of pristine, La-doped, and La/Cr-co-doped BiFeO3: Solid-state syntheses, characterization, and first-principle calculations. International Union of Materials Research Societies - International Conference on Electronic Materials 2014 (IUMRS-ICEM 2014), Taipei, Taiwan. 
215. Yi-kai Kuo, Trong Lan Nguyen, and Shih-kang Lin (2014, Jun). Interfacial reactions between Sn-0.7Cu-xGa solders and Cu substrates and phase equilibria of the Cu-Ga-Sn ternary system at 200 degree C. International Union of Materials Research Societies - International Conference on Electronic Materials 2014 (IUMRS-ICEM 2014), Taipei, Taiwan. 
216. Yu-hsiang Wang, Hui-chin Kuo, and Shih-kang Lin (2014, Jun). Interfacial reactions in the Cu/In/Ni thermal management module. International Union of Materials Research Societies - International Conference on Electronic Materials 2014 (IUMRS-ICEM 2014), Taipei, Taiwan. 
217. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu(2014年05月)。Ab initio screening of 3d transition metal-doped Li4Ti5O12 defect spinel anodes for Li ion batteries。2014 Chinese Ceramic Society Annual Meeting,Taipei, Taiwan。
218. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu(2014年02月)。Li4Me5O12 defect spinel oxides as new electrode materials for lithium ion batteries by ab initio calculation。13th Workshop on First-Principles Computational Materials Physics,Kenting, Taiwan。
219. Shu-chang Wu, Chi-ling Cheng, Shih-kang Lin, and Chuan Zhang(2014年02月)。第一原理輔相圖計算建構鈮錸二元系統熱力學模型。13th Workshop on First-Principles Computational Materials Physics,Kenting, Taiwan。
220. Hao-miso Chang, Cheng-liang Cho, Yi-kai Kuo, and Shih-kang Lin (2014, Feb). Ga-based Cu-to-Cu Interconnection with Pt UBM. 143rd TMS Annual Meeting & Exhibition (TMS 2014), San Diego, California, USA. 
221. Ming-yueh Tsai and Shih-kang Lin (2014, Feb). Periodic Layer Formation in the Au-12Ge/Ni Diffusion Couple. 143rd TMS Annual Meeting & Exhibition (TMS 2014), San Diego, California, USA. 
222. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu (2014, Feb). Exploring Nature's Missing Li4Me5O12 Defect Spinel Oxides by Ab Initio Calculations. 143rd TMS Annual Meeting & Exhibition (TMS 2014), San Diego, California, USA. 
223. Shih-kang Lin, Chao-kuei Yeh, Yu-chen Liu, and Masahiro Yoshimura (2014, Feb). Why does an Electric Current Change the Stability of Solder? 13th Workshop on First-Principles Computational Materials Physics, Kenting, Taiwan. 
224. Shih-kang Lin, Chao-kuei Yeh, Yu-chen Liu, and Masahiro Yoshimura (2014, Feb). Why Does an Electric Current Change the Stability of Solder? 143rd TMS Annual Meeting & Exhibition (TMS 2014), San Diego, California, USA. 
225. Trong Lan Nguyen and Shih-kang Lin (2014, Feb). Effective Suppression of Sn-58Bi/Cu Interfacial Reactions with Minor Ga Addition. 143rd TMS Annual Meeting & Exhibition (TMS 2014), San Diego, California, USA. 
226. Yu-hsiang Wang, Hui-chin Kuo, and Shih-kang Lin (2014, Feb). Characterization of Interfacial Reactions in Cu/In/Ni Joints at 280 degree C. 143rd TMS Annual Meeting & Exhibition (TMS 2014), San Diego, California, USA. 
227. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu (2014, Jan). Ab Initio study on nature's missing Li4Me5O12 defect spinel oxides. PSROC Annual Meeting, Taichung, Taiwan. 
228. Ping-chun Tsai, Shih-kang Lin and Wen-Dung Hsu (2013, Dec). Designing the doped Li4Ti5O12 anode materials with long cycle life and high-rate by ab initio calculations. 2013 MRS Falll Meeting & Exhibition (2013 MRS), Boston, Massachusetts, USA. nstc 101-2221-E-006-113. 
229. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu (2013, Dec). Ab initio screening of electronic structures and electrochemical properties of transition metal-doped Li4Ti5O12 defect spinel as anode materials in lithium ion batteries. 5th PCGMR symposium on Nano-Technology/-Materials for Energy, Electronics and Others (PCGMR 2013), Tainan, Taiwan. 
230. Shih-kang Lin (Invited), Chao-kuei Yeh, Yu-chen Liu, abd Masahiro Yoshimura (2013, Dec). Why Does an Electric Current Change the Stability of Solder?. 5th PCGMR symposium on Nano-Technology/-Materials for Energy, Electronics and Others (PCGMR 2013), Tainan, Taiwan. 
231. Shu-chang Wu, Ki-ling Cheng, Chuan Zhang, and Shih-kang Lin (2013, Dec). Ab initio-aided CALPHAD of NbRe System. 5th PCGMR symposium on Nano-Technology/-Materials for Energy, Electronics and Others (PCGMR 2013), Tainan, Taiwan. 
232. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu (2013, Nov). An ab initio study on transition metal doped Li4M0.125Ti4.875O12 defect spinel (M = Zr, V, Nb, Ta, Cr, Mo, W, Mn, Fe, Co, Ni, Cu, and Zn) as anode materials in lithium ion batteries. 4th International Symposium on Advanced Ceramics and Technology for Sustainable Energy Applications toward a Low Carbon Society (ACTSEA 2013), Taipei, Taiwan. 
233. Chao-kuei Yeh, Yu-chen Liu, Mei-jun Wang, and Shih-kang Lin (2013, Oct). On the non-polarity effects Of the Bi/Ni interfaces under current stressing. 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan. nstc 101-2221-E-006-113. 
234. Hao-miao Chang, Cheng-liang Cho, Yi-kai Kuo, and Shih-kang Lin (2013, Oct). A novel Ga-based TSV interconnection with Pt UBM. 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan. nstc 101-2221-E-006-113. 
235. Ming-yueh Tsai and Shih-kang Lin (2013, Oct). Formation of alternating interfacial layers in the Au-12Ge/Ni joints. 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan. nstc 101-2221-E-006-113. 
236. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu (2013, Oct). Structural and electrical properties of 3d transition metal-doped Li4Ti5O12 defect spinel by ab initio calculations. 2013 Chinese Institute of Mining and Metallurgical Engineering Annual meeting (CIMME 2013), Miaoli, Taiwan. nstc 101-2221-E-006-113. 
237. Trong Lan Nguyen and Shih-kang Lin (2013, Oct). Effective retardation of Sn-58Bi/Cu interfacial reactions with minor Ga addition. 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan. nstc 101-2221-E-006-113. 
238. Yi-kai Kuo, Cheng-liang Cho, Yu-chen Liu, and Shih-kang Lin (2013, Oct). Reactive Wetting of Molten Ga solder on Poly-crystalline, Single-crystalline and Pt-coated Cu Substrates. 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan. nstc 101-2221-E-006-113. 
239. Yu-hsiang Wang and Shih-kang Lin (2013, Oct). Interfacial reactions in the Cu/In/Ni sandwich couples at 280°C. 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), Taipei, Taiwan. nstc 101-2221-E-006-113. 
240. Ming-yueh Tsai and Shih-kang Lin(2013年10月)。Alternating reaction layer formation in the Au-12Ge/Ni joints。2013 Materials Research Society-Taiwan Annual Meeting (MRS-T 2013), Taoyuan, Taiwan。nstc 101-2221-E-006-113。
241. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu(2013年10月)。The ab initio study on structural and electrical properties of the doped Li4Ti5O12 anode for Li ion batteries。2013 Materials Research Society-Taiwan Annual Meeting (MRS-T 2013). Taoyuan, Taiwan。nstc 101-2221-E-006-113.
242. Yu-ching Chang, Bo-hsun Hsu, and Shih-kang Lin(2013年10月)。Interfacial reaction between Au-Ge solders and Cu substrates。2013 Materials Research Society-Taiwan Annual Meeting (MRS-T 2013),Taoyuan, Taiwan。nstc 101-2221-E-006-113.
243. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu(2013年05月)。Atomistic structures of the lithium titanate spinel oxides: An ab initio study。2013 Chinese Ceramic Society Annual Meeting,Taipei, Taiwan。nstc 101-2221-E-006-113.
244. Ping-chun Tsai, Shih-kang Lin, and Wen-Dung Hsu(2013年05月)。Doping effects upon the Li4Ti5O12 spinel as anode materials in Li ion batteries。2013 Chinese Chemistry Society (Kaohsuing branching) Annual meeting,Kaohsiung, Taiwan。nstc 101-2221-E-006-113。
245. Bo-hsun Hsu and Shih-kang Lin (2013, Mar). Interfacial reactions between Au-Ge eutectic solders and Cu substrates. 142nd TMS Annual Meeting & Exhibition (TMS 2013), San Antonio, Texas, USA. nstc 101-2221-E-006-113. 
246. Chao-kuei Yeh and Shih-kang Lin (2013, Mar). Supersaturation and phase stability of Pb-Sn alloys under current stressing. 142nd TMS Annual Meeting & Exhibition (TMS 2013), San Antonio, Texas, USA. nstc 101-2221-E-006-113. 
247. Chao-kuei Yeh and Shih-kang Lin(2012年11月)。Ab initio-aided CALPHAD thermodynamic modeling the Pb-Sn binary system under current stressing。2012 Materials Research Society-Taiwan Annual Meeting (MRS-T 2012),Yunlin, Taiwan。nstc 100-2218-E-006-034。
248. Bo-Hsun Hsu and Shih-kang Lin (2012, Nov). Interfacial reactions between molten Au-Ge eutectic alloy and Cu substrate at 400 degree C. Visual-JW 2012, Osaka, Japan. nstc 100-2218-E-006-034. 
249. Cheng-liang Cho and Shih-kang Lin (2012, Nov). Novel Ga-based Cu-to-Cu interconnection in 3D IC technology. Visual-JW 2012, Osaka, Japan. nstc 100-2218-E-006-034. 
250. Trong Lan Nguyen and Shih-kang Lin (2012, Nov). 100 degree C isothermal section of the Bi-Ga-Sn ternary system. 4th PCGMR symposium on Nano-Technology/Materials for Bio-Medical Application (PCGMR2012), Tainan, Taiwan. nstc 100-2218-E-006-034. 
251. Bo-Hsun Hsu and Shih-kang Lin (2012, Oct). Soldering reactions between Au-Ge high temperature Pb-free solders and Cu substrates. 7th IMPACT Conference (iMPACT 2012), Taipei,Taiwan. nstc 100-2218-E-006-034. 
252. Brian Puchala, Shih-kang Lin, Ligen Wang and Dane Morgan (2012, Oct). PEMFC Nanoparticle Dealloying from Kinetic Monte Carlo Simulations. Pacific RIM Meeting on Electrochemical and Solid-state Science (PRiME 2012), Honolulu, HI, USA. 
253. Shih-kang Lin, Brian Puchala, Yueh-Lin Lee and Dane Morgan (2012, Sep). Ab initio energetics of charge compensating point defects. International Union of Materials Research Society - International Conference on Electronic Materials (IUMRS-ICEM 2012), Yokohama, Kanagawa, Japan. nstc 100-2218-E-006-034. 
254. Dane Morgan, Yueh-Lin Le

專書著作

  1. Udit S. Mohanty;Kwang-Lung Lin,"Electrodeposition: Properties, Processes and Applications",[link]
  2. Udit S. Mohanty*;S. Y. Chen;Kwang-Lung Lin,"Smart Nanoparticles Technology",[link]
  3. Kwang-Lung Lin,"Electromigration in Thin Films and Electronic Devices:Materials and Reliability",[link]

Other Publications

  1. 林光隆,"”無鉛錫球之技術",[link]
  2. 林光隆;宋振銘;黃家緯,"”Sn-Zn 系無鉛銲錫合金與基材界面金屬間化合物生成之探討”, 界面科學會誌",[link]
  3. 黃家緯;林光隆,"”電子構裝無鉛銲錫的現況與發展”,銲皆與切割",[link]
  4. 林光隆;宋振銘,"”Sn-Zn系列無鉛銲錫合金研究現況” 材料會訊",[link]
  5. Kwang-Lung Lin,"“Recent Academic Research Progress in Materaisl in Taiwan,” IUMRS Facets",[link]
  6. 林光隆,"”鋼筋覆層防蝕方法探討”,土木工程技術",[link]
  7. 林建泰;林光隆,"”覆晶接合銲錫隆點之製程以及真空技術製作之UBM”,真空科技",[link]
  8. 劉業繡;林光隆,"”焊錫可靠度分析”, 電子月刊",[link]
  9. 林光隆,"”無煙助熔劑之研發”,飛躍的台鍍",[link]
  10. 林光隆,"”電子構裝覆晶接合技術” 科儀新知",[link]
  11. 林光隆,"“電子構裝「無構裝」化趨勢”,電子月刊",[link]
  12. 陳俊仁;林光隆,"”銲錫性之量測-潤濕天平”,銲接與切割",[link]
  13. 林光隆,"“覆晶接合技術與其銲錫隆點製程”,電子月刊",[link]
  14. 林光隆;鍾富智;李汝桐,""蘭嶼核廢料貯存壕溝貯存桶熱浸鍍鋅、鋁鋅耐蝕壽命",防蝕工程",[link]
  15. 溫麗箱;陳俊仁;林光隆,""無鉛焊錫的簡介及未來的展望",電子資訊",[link]
  16. 林光隆,""熱浸鍍鋅製程、規格、原理與物件設計",熱浸鍍鋅",[link]
  17. 林光隆,""熱浸鍍鋅相關報導及研發趨勢分析",熱浸鍍鋅",[link]
  18. 林光隆,""臺灣熱浸鍍鋅產業的發展與現況(1994)", 防蝕工程",[link]
  19. 黃新營;林光隆,""臺灣地區一般熱浸鍍鋅產品之市場分析與未來預測", 熱浸鍍鋅雜誌",[link]
  20. 林光隆;李汝桐,""臺灣熱浸鍍鋅工業現況",熱浸鍍鋅雜誌",[link]
  21. 何晉國;林光隆,""熱浸鍍鋅, 5% 鋁鋅於含氫氧化鈣環境中之適用性", 熱浸鍍鋅雜誌",[link]
  22. 林光隆,""美國金門大橋五十年的腐蝕研究", 熱浸鍍鋅雜誌",[link]
  23. 林光隆,""鍍鋅層剝落的成因與對策"熱浸鍍鋅雜誌",[link]
  24. 林光隆,""廢液中重金屬之回收與轉化", 資源再生及其污染防治技術研討會論文集",[link]
  25. 林光隆,""逆滲透膜於重金屬廢液處理之研究",金屬再生及其污染防治技術研討會論文集",[link]
  26. 林光隆,""在熱浸鍍鋅鋼筋混凝土池裡游泳", "鋅保護光纖管路", 熱浸鍍鋅雜誌",[link]
  27. 林光隆,""熱浸鍍鋅層的成長", 熱浸鍍鋅雜誌",[link]
  28. 林光隆,""熱浸鍍鋅耐蝕處理探討" 熱浸鍍鋅雜誌",[link]
  29. K. L. Lin,"Interfacial Charge, Micellization and Mass Transfer in Hydrometallurgical SolventExtraction : A Hydroxyoxime-Sulfonic Acid Mixed Extractant System",[link]
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